Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance

The additive manufacturing technology of laser-based powder bed fusion (L-PBF), which is used to produce boiling heat transfer structures, offers a high processing flexibility and can provide lattice structures with a high surface-to-volume ratio. As an important part of the phased array radar, the...

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Autores principales:	Bo Qian, Hongri Fan, Gang Liu, Jianrui Zhang, Pei Li
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	transmit/receive (T/R) module laser-based powder bed fusion (L-PBF) microchannel structure boiling heat transfer additive manufacturing Mining engineering. Metallurgy TN1-997
Acceso en línea:	https://doaj.org/article/a49e316d001d42d5b8461f0028b5bca3
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spelling	oai:doaj.org-article:a49e316d001d42d5b8461f0028b5bca32021-11-25T18:21:32ZSelf-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance10.3390/met111117312075-4701https://doaj.org/article/a49e316d001d42d5b8461f0028b5bca32021-10-01T00:00:00Zhttps://www.mdpi.com/2075-4701/11/11/1731https://doaj.org/toc/2075-4701The additive manufacturing technology of laser-based powder bed fusion (L-PBF), which is used to produce boiling heat transfer structures, offers a high processing flexibility and can provide lattice structures with a high surface-to-volume ratio. As an important part of the phased array radar, the plentiful transmit/receive (T/R) modules can generate considerable heat. Targeting this local overheating problem, this study discusses the pass design, the optimal formation process, and boiling heat transfer performance of microchannel liquid-cooled plates based on L-PBF additive manufacturing technology. The optimum design and process parameters were obtained by performing basic channel experiments. On this basis, the design and formation experiments of the microchannel structure were performed, and then the porosity and pore morphology of microchannel liquid-cooled plate samples were analysed. The boiling heat transfer experiments were conducted with deionised water, and the boiling heat transfer characteristics were compared with the saturated boiling curve of a traditional copper-tube liquid-cooled plate. The average wall temperature of the designed samples decreased by 4% compared with that of the traditional liquid-cooled plate under the same heat flow density the value reduced from 111.9 °C to 108.2 °C. Furthermore, within the same optimal boiling temperature range, the average heat flow densities of all the prepared samples increased by >60% compared with those of the traditional liquid-cooled plate the value increased from minimum 16 W∙cm<sup>−2</sup> to maximum 34 W∙cm<sup>−2</sup>. The self-supporting microchannel structure can considerably improve the heat dissipation effect of T/R modules and solve the local overheating problem.Bo QianHongri FanGang LiuJianrui ZhangPei LiMDPI AGarticletransmit/receive (T/R) modulelaser-based powder bed fusion (L-PBF)microchannel structureboiling heat transferadditive manufacturingMining engineering. MetallurgyTN1-997ENMetals, Vol 11, Iss 1731, p 1731 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	transmit/receive (T/R) module laser-based powder bed fusion (L-PBF) microchannel structure boiling heat transfer additive manufacturing Mining engineering. Metallurgy TN1-997
spellingShingle	transmit/receive (T/R) module laser-based powder bed fusion (L-PBF) microchannel structure boiling heat transfer additive manufacturing Mining engineering. Metallurgy TN1-997 Bo Qian Hongri Fan Gang Liu Jianrui Zhang Pei Li Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
description	The additive manufacturing technology of laser-based powder bed fusion (L-PBF), which is used to produce boiling heat transfer structures, offers a high processing flexibility and can provide lattice structures with a high surface-to-volume ratio. As an important part of the phased array radar, the plentiful transmit/receive (T/R) modules can generate considerable heat. Targeting this local overheating problem, this study discusses the pass design, the optimal formation process, and boiling heat transfer performance of microchannel liquid-cooled plates based on L-PBF additive manufacturing technology. The optimum design and process parameters were obtained by performing basic channel experiments. On this basis, the design and formation experiments of the microchannel structure were performed, and then the porosity and pore morphology of microchannel liquid-cooled plate samples were analysed. The boiling heat transfer experiments were conducted with deionised water, and the boiling heat transfer characteristics were compared with the saturated boiling curve of a traditional copper-tube liquid-cooled plate. The average wall temperature of the designed samples decreased by 4% compared with that of the traditional liquid-cooled plate under the same heat flow density the value reduced from 111.9 °C to 108.2 °C. Furthermore, within the same optimal boiling temperature range, the average heat flow densities of all the prepared samples increased by >60% compared with those of the traditional liquid-cooled plate the value increased from minimum 16 W∙cm<sup>−2</sup> to maximum 34 W∙cm<sup>−2</sup>. The self-supporting microchannel structure can considerably improve the heat dissipation effect of T/R modules and solve the local overheating problem.
format	article
author	Bo Qian Hongri Fan Gang Liu Jianrui Zhang Pei Li
author_facet	Bo Qian Hongri Fan Gang Liu Jianrui Zhang Pei Li
author_sort	Bo Qian
title	Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
title_short	Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
title_full	Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
title_fullStr	Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
title_full_unstemmed	Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
title_sort	self-supporting microchannel liquid-cooled plate for t/r modules based on additive manufacturing: study on its pass design, formation process and boiling heat transfer performance
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/a49e316d001d42d5b8461f0028b5bca3
work_keys_str_mv	AT boqian selfsupportingmicrochannelliquidcooledplatefortrmodulesbasedonadditivemanufacturingstudyonitspassdesignformationprocessandboilingheattransferperformance AT hongrifan selfsupportingmicrochannelliquidcooledplatefortrmodulesbasedonadditivemanufacturingstudyonitspassdesignformationprocessandboilingheattransferperformance AT gangliu selfsupportingmicrochannelliquidcooledplatefortrmodulesbasedonadditivemanufacturingstudyonitspassdesignformationprocessandboilingheattransferperformance AT jianruizhang selfsupportingmicrochannelliquidcooledplatefortrmodulesbasedonadditivemanufacturingstudyonitspassdesignformationprocessandboilingheattransferperformance AT peili selfsupportingmicrochannelliquidcooledplatefortrmodulesbasedonadditivemanufacturingstudyonitspassdesignformationprocessandboilingheattransferperformance
_version_	1718411277681819648

Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance

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