Fanless, porous graphene-copper composite heat sink for micro devices

Abstract Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a...

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Autores principales:	Hokyun Rho, Yea Sol Jang, Hyojung Bae, An-Na Cha, Sang Hyun Lee, Jun-Seok Ha
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/a6a7110845c84490bdc8b7b1c73e1b86
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spelling	oai:doaj.org-article:a6a7110845c84490bdc8b7b1c73e1b862021-12-02T16:38:25ZFanless, porous graphene-copper composite heat sink for micro devices10.1038/s41598-021-97165-y2045-2322https://doaj.org/article/a6a7110845c84490bdc8b7b1c73e1b862021-09-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-97165-yhttps://doaj.org/toc/2045-2322Abstract Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a heat sink fabricated using copper with porous structures consisting of single-layer graphene on the surface and graphene oxide inside the pores. The porous copper/single-layer graphene/graphene oxide composite (p-Cu/G/rGO) had a porosity of approximately 35%, and the measured pore size was approximately 10 to 100 µm. The internal GO was reduced at a temperature of 1000 °C. On observing the heat distribution in the structure using a thermal imaging camera, we could observe that the p-Cu/G/rGO was conducting heat faster than the p-Cu, which was consistent with the simulation. Furthermore, the thermal resistance of p-Cu/G/rGO was lower than those of the p-Cu and pure Cu. When the p-Cu/G/rGO was fabricated into a heat sink to mount the light emitting diode (LED) chip, the measured temperature of the LED was 31.04 °C, which was less than the temperature of the pure Cu of 40.8 °C. After a week of being subjected to high power (1000 mA), the light intensity of p-Cu/G/rGO decreased to 95.24%. However, the pure Cu decreased significantly to 66.04%. The results of this study are expected to be applied to micro devices for their effective thermal management.Hokyun RhoYea Sol JangHyojung BaeAn-Na ChaSang Hyun LeeJun-Seok HaNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-7 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Hokyun Rho Yea Sol Jang Hyojung Bae An-Na Cha Sang Hyun Lee Jun-Seok Ha Fanless, porous graphene-copper composite heat sink for micro devices
description	Abstract Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a heat sink fabricated using copper with porous structures consisting of single-layer graphene on the surface and graphene oxide inside the pores. The porous copper/single-layer graphene/graphene oxide composite (p-Cu/G/rGO) had a porosity of approximately 35%, and the measured pore size was approximately 10 to 100 µm. The internal GO was reduced at a temperature of 1000 °C. On observing the heat distribution in the structure using a thermal imaging camera, we could observe that the p-Cu/G/rGO was conducting heat faster than the p-Cu, which was consistent with the simulation. Furthermore, the thermal resistance of p-Cu/G/rGO was lower than those of the p-Cu and pure Cu. When the p-Cu/G/rGO was fabricated into a heat sink to mount the light emitting diode (LED) chip, the measured temperature of the LED was 31.04 °C, which was less than the temperature of the pure Cu of 40.8 °C. After a week of being subjected to high power (1000 mA), the light intensity of p-Cu/G/rGO decreased to 95.24%. However, the pure Cu decreased significantly to 66.04%. The results of this study are expected to be applied to micro devices for their effective thermal management.
format	article
author	Hokyun Rho Yea Sol Jang Hyojung Bae An-Na Cha Sang Hyun Lee Jun-Seok Ha
author_facet	Hokyun Rho Yea Sol Jang Hyojung Bae An-Na Cha Sang Hyun Lee Jun-Seok Ha
author_sort	Hokyun Rho
title	Fanless, porous graphene-copper composite heat sink for micro devices
title_short	Fanless, porous graphene-copper composite heat sink for micro devices
title_full	Fanless, porous graphene-copper composite heat sink for micro devices
title_fullStr	Fanless, porous graphene-copper composite heat sink for micro devices
title_full_unstemmed	Fanless, porous graphene-copper composite heat sink for micro devices
title_sort	fanless, porous graphene-copper composite heat sink for micro devices
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/a6a7110845c84490bdc8b7b1c73e1b86
work_keys_str_mv	AT hokyunrho fanlessporousgraphenecoppercompositeheatsinkformicrodevices AT yeasoljang fanlessporousgraphenecoppercompositeheatsinkformicrodevices AT hyojungbae fanlessporousgraphenecoppercompositeheatsinkformicrodevices AT annacha fanlessporousgraphenecoppercompositeheatsinkformicrodevices AT sanghyunlee fanlessporousgraphenecoppercompositeheatsinkformicrodevices AT junseokha fanlessporousgraphenecoppercompositeheatsinkformicrodevices
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Fanless, porous graphene-copper composite heat sink for micro devices

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