Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties
There is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work,...
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Budapest University of Technology
2022
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oai:doaj.org-article:abf3a37a73ae455ca1c9189055a74cff2021-12-01T09:25:39ZConstruction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties1788-618X10.3144/expresspolymlett.2022.12https://doaj.org/article/abf3a37a73ae455ca1c9189055a74cff2022-02-01T00:00:00Zhttp://www.expresspolymlett.com/letolt.php?file=EPL-0011590&mi=cdhttps://doaj.org/toc/1788-618XThere is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielectric permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielectric permittivity (2.47) and dielectric loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the molecular polarizability but also increased the free fractional volume. In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI molecular chains, resulting in the inhibition of the molecular mobility. The incorporation of TAPB also enhanced the thermal stability and ultraviolet light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielectric permittivity for the electronic industry.Wanjing ZhaoXianwu CaoJinshu HuangJiangwei WenYun HeJunwei ZhaRobert Kwok Yiu LiWei WuBudapest University of Technology articlepolymer synthesis, molecular engineeringpolyimidelow dielectric permittivitymechanical propertycross-linkingMaterials of engineering and construction. Mechanics of materialsTA401-492Chemical technologyTP1-1185ENeXPRESS Polymer Letters, Vol 16, Iss 2, Pp 142-151 (2022) |
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polymer synthesis, molecular engineering polyimide low dielectric permittivity mechanical property cross-linking Materials of engineering and construction. Mechanics of materials TA401-492 Chemical technology TP1-1185 |
spellingShingle |
polymer synthesis, molecular engineering polyimide low dielectric permittivity mechanical property cross-linking Materials of engineering and construction. Mechanics of materials TA401-492 Chemical technology TP1-1185 Wanjing Zhao Xianwu Cao Jinshu Huang Jiangwei Wen Yun He Junwei Zha Robert Kwok Yiu Li Wei Wu Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
description |
There is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielectric permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielectric permittivity (2.47) and dielectric loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the molecular polarizability but also increased the free fractional volume. In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI molecular chains, resulting in the inhibition of the molecular mobility. The incorporation of TAPB also enhanced the thermal stability and ultraviolet light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielectric permittivity for the electronic industry. |
format |
article |
author |
Wanjing Zhao Xianwu Cao Jinshu Huang Jiangwei Wen Yun He Junwei Zha Robert Kwok Yiu Li Wei Wu |
author_facet |
Wanjing Zhao Xianwu Cao Jinshu Huang Jiangwei Wen Yun He Junwei Zha Robert Kwok Yiu Li Wei Wu |
author_sort |
Wanjing Zhao |
title |
Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
title_short |
Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
title_full |
Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
title_fullStr |
Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
title_full_unstemmed |
Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
title_sort |
construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties |
publisher |
Budapest University of Technology |
publishDate |
2022 |
url |
https://doaj.org/article/abf3a37a73ae455ca1c9189055a74cff |
work_keys_str_mv |
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1718405373698768896 |