Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties

There is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work,...

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Autores principales: Wanjing Zhao, Xianwu Cao, Jinshu Huang, Jiangwei Wen, Yun He, Junwei Zha, Robert Kwok Yiu Li, Wei Wu
Formato: article
Lenguaje:EN
Publicado: Budapest University of Technology 2022
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Acceso en línea:https://doaj.org/article/abf3a37a73ae455ca1c9189055a74cff
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