INVESTIGATION OF THE INFLUENCE OF INFORMATION SECURITY CELL STACK MATERIAL PARAMETERS ON ITS RELIABILITY
Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices of medium complexity and higher have a base in the form of a stack-a set of layers for various purposes, which are subsequently pressed into a single printed circuit board. The materials used for the...
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| Autores principales: | , , |
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| Formato: | article |
| Lenguaje: | EN RU |
| Publicado: |
Penza State University Publishing House
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/ae251a803ffd4bb8a0662eea986eb879 |
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| Sumario: | Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices of medium
complexity and higher have a base in the form of a stack-a set of layers for various purposes, which are subsequently
pressed into a single printed circuit board. The materials used for the formation of these layers play a significant role
in the further performance of the electronic device, since they have different electrical, thermal and mechanical parameters
that determine the advantages of a particular stack and, accordingly, the possible limitations of the device made on
its basis. Materials and methods. The quality of the materials used for printed circuit boards is characterized by a variety
of technical parameters that can significantly affect the characteristics of the final electronic devices. The negative impact
of the materials of the printed circuit board stack can manifest itself both immediately after the manufacture of the
product, and during operation, leading to instantaneous or delayed failures of various types of criticality. Results. It is established
that in the conditions of production of modern electronic devices and printed circuit boards for them, including
those operating in high-frequency bands, the quality of their work can be influenced by a variety of factors. The paper
shows that in order to minimize the possible risks associated with various physical phenomena and the resulting
parasitic parameters of printed circuit board materials, it is necessary to conduct a simulation of its operation, taking into
account the possible parameters of the materials used and their impact on at least the most critical areas – the printed
circuit board, the installation sites of microcircuits and other radio elements. The values of the amount of heat released
per unit of its area are determined, since many characteristics of electronic components and printed circuit board materials,
their performance depends on the temperature regime within which they operate. Conclusions. The performed
studies allow us to exclude possible consequences of an increase in temperature in the device, for example, a change in
the shape of the transmitted signals, degradation of materials, thermal expansion of the board elements and, as a result,
rupture or damage to the copper tracks at the junction-the outer layer-the transition hole. |
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