Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method

As drilling process for carbon fiber reinforced plastic (CFRP), gyro-driving drilling machine has been proposed. Recently, Cu-based diamond grinding wheels for this drilling machine have been fabricated by using centrifugal mixed-powder method (CMPM). However, because diamond abrasive grains in this...

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Autores principales:	Hisashi SATO, Akira MIZUNO, Yuta MAMIYA, Motoko YAMADA, Yoshimi WATANABE
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2016
Materias:	composite centrifugal mixed-powder method (cmpm) bonding force bonding test cu diamond wear property Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/b7fc82e038064be5846b5290db7f9f59
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spelling	oai:doaj.org-article:b7fc82e038064be5846b5290db7f9f592021-11-26T06:58:32ZImprovement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method2187-974510.1299/mej.16-00297https://doaj.org/article/b7fc82e038064be5846b5290db7f9f592016-11-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/3/6/3_16-00297/_pdf/-char/enhttps://doaj.org/toc/2187-9745As drilling process for carbon fiber reinforced plastic (CFRP), gyro-driving drilling machine has been proposed. Recently, Cu-based diamond grinding wheels for this drilling machine have been fabricated by using centrifugal mixed-powder method (CMPM). However, because diamond abrasive grains in this grinding wheel are dispersed into pure Cu matrix, drop out of the diamond grains occurs due to low wettability between Cu and diamond. In this study, improvement of bonding force between Cu matrix and diamond grains in Cu/diamond composite fabricated by the CMPM is investigated. As improvement method, Ti particles are added into mixed-powder used for the CMPM. This addition of Ti particles forms thin TiC layer at interface between the Cu matrix and the diamond grain. Thickness of the TiC layer increases as the amount of Ti particles in the mixed-powder increases. As the results, the bonding force between the Cu matrix and diamond grains is improved by the addition of Ti particles. The bonding force is increased as Ti concentration in the mixed-powder increases up to 2 mass%. When the Ti concentration exceeds 2 mass%, the bonding force is saturated. Also, the Cu/diamond composite containing Ti makes larger worn groove on counter disc used for wear test comparing with the composite without Ti. Therefore, the addition of Ti particles into the mixed-powder can be expected to enhance grinding ability of Cu-based diamond grinding wheel fabricated by the CMPM.Hisashi SATOAkira MIZUNOYuta MAMIYAMotoko YAMADAYoshimi WATANABEThe Japan Society of Mechanical Engineersarticlecompositecentrifugal mixed-powder method (cmpm)bonding forcebonding testcudiamondwear propertyMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 3, Iss 6, Pp 16-00297-16-00297 (2016)
institution	DOAJ
collection	DOAJ
language	EN
topic	composite centrifugal mixed-powder method (cmpm) bonding force bonding test cu diamond wear property Mechanical engineering and machinery TJ1-1570
spellingShingle	composite centrifugal mixed-powder method (cmpm) bonding force bonding test cu diamond wear property Mechanical engineering and machinery TJ1-1570 Hisashi SATO Akira MIZUNO Yuta MAMIYA Motoko YAMADA Yoshimi WATANABE Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method
description	As drilling process for carbon fiber reinforced plastic (CFRP), gyro-driving drilling machine has been proposed. Recently, Cu-based diamond grinding wheels for this drilling machine have been fabricated by using centrifugal mixed-powder method (CMPM). However, because diamond abrasive grains in this grinding wheel are dispersed into pure Cu matrix, drop out of the diamond grains occurs due to low wettability between Cu and diamond. In this study, improvement of bonding force between Cu matrix and diamond grains in Cu/diamond composite fabricated by the CMPM is investigated. As improvement method, Ti particles are added into mixed-powder used for the CMPM. This addition of Ti particles forms thin TiC layer at interface between the Cu matrix and the diamond grain. Thickness of the TiC layer increases as the amount of Ti particles in the mixed-powder increases. As the results, the bonding force between the Cu matrix and diamond grains is improved by the addition of Ti particles. The bonding force is increased as Ti concentration in the mixed-powder increases up to 2 mass%. When the Ti concentration exceeds 2 mass%, the bonding force is saturated. Also, the Cu/diamond composite containing Ti makes larger worn groove on counter disc used for wear test comparing with the composite without Ti. Therefore, the addition of Ti particles into the mixed-powder can be expected to enhance grinding ability of Cu-based diamond grinding wheel fabricated by the CMPM.
format	article
author	Hisashi SATO Akira MIZUNO Yuta MAMIYA Motoko YAMADA Yoshimi WATANABE
author_facet	Hisashi SATO Akira MIZUNO Yuta MAMIYA Motoko YAMADA Yoshimi WATANABE
author_sort	Hisashi SATO
title	Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method
title_short	Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method
title_full	Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method
title_fullStr	Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method
title_full_unstemmed	Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method
title_sort	improvement of bonding force between abrasive grains and matrix in cu/diamond composite fabricated by centrifugal mixed-powder method
publisher	The Japan Society of Mechanical Engineers
publishDate	2016
url	https://doaj.org/article/b7fc82e038064be5846b5290db7f9f59
work_keys_str_mv	AT hisashisato improvementofbondingforcebetweenabrasivegrainsandmatrixincudiamondcompositefabricatedbycentrifugalmixedpowdermethod AT akiramizuno improvementofbondingforcebetweenabrasivegrainsandmatrixincudiamondcompositefabricatedbycentrifugalmixedpowdermethod AT yutamamiya improvementofbondingforcebetweenabrasivegrainsandmatrixincudiamondcompositefabricatedbycentrifugalmixedpowdermethod AT motokoyamada improvementofbondingforcebetweenabrasivegrainsandmatrixincudiamondcompositefabricatedbycentrifugalmixedpowdermethod AT yoshimiwatanabe improvementofbondingforcebetweenabrasivegrainsandmatrixincudiamondcompositefabricatedbycentrifugalmixedpowdermethod
_version_	1718409741462405120

Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method

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