Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics m...
Guardado en:
Autores principales: | , , , , , , |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
De Gruyter
2021
|
Materias: | |
Acceso en línea: | https://doaj.org/article/b83a3da4c38c4de19a702040f68915f6 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
id |
oai:doaj.org-article:b83a3da4c38c4de19a702040f68915f6 |
---|---|
record_format |
dspace |
spelling |
oai:doaj.org-article:b83a3da4c38c4de19a702040f68915f62021-12-05T14:10:48ZStudy on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride1618-722910.1515/epoly-2021-0069https://doaj.org/article/b83a3da4c38c4de19a702040f68915f62021-09-01T00:00:00Zhttps://doi.org/10.1515/epoly-2021-0069https://doaj.org/toc/1618-7229To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics model of h-BN/epoxy composites was established, and the thermal conductivity, volume resistivity, glass transition temperature, and microstructure parameters of h-BN/epoxy composites were obtained. When the h-BN content is 40 phr, the thermal conductivity of h-BN/epoxy composite is increased by 138% compared to pure EP, and the glass transition temperature is increased by 76 K. At the same time, doping h-BN will reduce the insulation performance of EP. However, the lowest volume resistivity of h-BN/epoxy composite is still 1.43 × 1015 Ω·cm, and the EP composite still has good insulation performance. The fraction free volume and mean square displacement of EP decrease with the doping of h-BN, which indicates that h-BN can hinder the movement of molecular segments of EP, which is the reason for the increase in glass transition temperature.Guo LeiDing ShilinYuan ShuaiGou XiaofengCai FenglinWang DongyangZhao HaiquanDe Gruyterarticleepoxy resinhexagonal boron nitridethermal conductivityglass transition temperaturevolume resistivityPolymers and polymer manufactureTP1080-1185ENe-Polymers, Vol 21, Iss 1, Pp 681-690 (2021) |
institution |
DOAJ |
collection |
DOAJ |
language |
EN |
topic |
epoxy resin hexagonal boron nitride thermal conductivity glass transition temperature volume resistivity Polymers and polymer manufacture TP1080-1185 |
spellingShingle |
epoxy resin hexagonal boron nitride thermal conductivity glass transition temperature volume resistivity Polymers and polymer manufacture TP1080-1185 Guo Lei Ding Shilin Yuan Shuai Gou Xiaofeng Cai Fenglin Wang Dongyang Zhao Haiquan Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
description |
To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics model of h-BN/epoxy composites was established, and the thermal conductivity, volume resistivity, glass transition temperature, and microstructure parameters of h-BN/epoxy composites were obtained. When the h-BN content is 40 phr, the thermal conductivity of h-BN/epoxy composite is increased by 138% compared to pure EP, and the glass transition temperature is increased by 76 K. At the same time, doping h-BN will reduce the insulation performance of EP. However, the lowest volume resistivity of h-BN/epoxy composite is still 1.43 × 1015 Ω·cm, and the EP composite still has good insulation performance. The fraction free volume and mean square displacement of EP decrease with the doping of h-BN, which indicates that h-BN can hinder the movement of molecular segments of EP, which is the reason for the increase in glass transition temperature. |
format |
article |
author |
Guo Lei Ding Shilin Yuan Shuai Gou Xiaofeng Cai Fenglin Wang Dongyang Zhao Haiquan |
author_facet |
Guo Lei Ding Shilin Yuan Shuai Gou Xiaofeng Cai Fenglin Wang Dongyang Zhao Haiquan |
author_sort |
Guo Lei |
title |
Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
title_short |
Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
title_full |
Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
title_fullStr |
Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
title_full_unstemmed |
Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
title_sort |
study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride |
publisher |
De Gruyter |
publishDate |
2021 |
url |
https://doaj.org/article/b83a3da4c38c4de19a702040f68915f6 |
work_keys_str_mv |
AT guolei studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride AT dingshilin studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride AT yuanshuai studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride AT gouxiaofeng studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride AT caifenglin studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride AT wangdongyang studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride AT zhaohaiquan studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride |
_version_ |
1718371742150295552 |