Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride

To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics m...

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Autores principales: Guo Lei, Ding Shilin, Yuan Shuai, Gou Xiaofeng, Cai Fenglin, Wang Dongyang, Zhao Haiquan
Formato: article
Lenguaje:EN
Publicado: De Gruyter 2021
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Acceso en línea:https://doaj.org/article/b83a3da4c38c4de19a702040f68915f6
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spelling oai:doaj.org-article:b83a3da4c38c4de19a702040f68915f62021-12-05T14:10:48ZStudy on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride1618-722910.1515/epoly-2021-0069https://doaj.org/article/b83a3da4c38c4de19a702040f68915f62021-09-01T00:00:00Zhttps://doi.org/10.1515/epoly-2021-0069https://doaj.org/toc/1618-7229To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics model of h-BN/epoxy composites was established, and the thermal conductivity, volume resistivity, glass transition temperature, and microstructure parameters of h-BN/epoxy composites were obtained. When the h-BN content is 40 phr, the thermal conductivity of h-BN/epoxy composite is increased by 138% compared to pure EP, and the glass transition temperature is increased by 76 K. At the same time, doping h-BN will reduce the insulation performance of EP. However, the lowest volume resistivity of h-BN/epoxy composite is still 1.43 × 1015 Ω·cm, and the EP composite still has good insulation performance. The fraction free volume and mean square displacement of EP decrease with the doping of h-BN, which indicates that h-BN can hinder the movement of molecular segments of EP, which is the reason for the increase in glass transition temperature.Guo LeiDing ShilinYuan ShuaiGou XiaofengCai FenglinWang DongyangZhao HaiquanDe Gruyterarticleepoxy resinhexagonal boron nitridethermal conductivityglass transition temperaturevolume resistivityPolymers and polymer manufactureTP1080-1185ENe-Polymers, Vol 21, Iss 1, Pp 681-690 (2021)
institution DOAJ
collection DOAJ
language EN
topic epoxy resin
hexagonal boron nitride
thermal conductivity
glass transition temperature
volume resistivity
Polymers and polymer manufacture
TP1080-1185
spellingShingle epoxy resin
hexagonal boron nitride
thermal conductivity
glass transition temperature
volume resistivity
Polymers and polymer manufacture
TP1080-1185
Guo Lei
Ding Shilin
Yuan Shuai
Gou Xiaofeng
Cai Fenglin
Wang Dongyang
Zhao Haiquan
Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
description To study the effect of doping hexagonal boron nitride (h-BN) on the thermal properties and insulation resistance of epoxy resin (EP) and the mechanism of this effect, h-BN/epoxy composites with h-BN content of 0, 10, 20, 30, and 40 phr were prepared. Meanwhile, the corresponding molecular dynamics model of h-BN/epoxy composites was established, and the thermal conductivity, volume resistivity, glass transition temperature, and microstructure parameters of h-BN/epoxy composites were obtained. When the h-BN content is 40 phr, the thermal conductivity of h-BN/epoxy composite is increased by 138% compared to pure EP, and the glass transition temperature is increased by 76 K. At the same time, doping h-BN will reduce the insulation performance of EP. However, the lowest volume resistivity of h-BN/epoxy composite is still 1.43 × 1015 Ω·cm, and the EP composite still has good insulation performance. The fraction free volume and mean square displacement of EP decrease with the doping of h-BN, which indicates that h-BN can hinder the movement of molecular segments of EP, which is the reason for the increase in glass transition temperature.
format article
author Guo Lei
Ding Shilin
Yuan Shuai
Gou Xiaofeng
Cai Fenglin
Wang Dongyang
Zhao Haiquan
author_facet Guo Lei
Ding Shilin
Yuan Shuai
Gou Xiaofeng
Cai Fenglin
Wang Dongyang
Zhao Haiquan
author_sort Guo Lei
title Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
title_short Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
title_full Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
title_fullStr Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
title_full_unstemmed Study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
title_sort study on the thermal properties and insulation resistance of epoxy resin modified by hexagonal boron nitride
publisher De Gruyter
publishDate 2021
url https://doaj.org/article/b83a3da4c38c4de19a702040f68915f6
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AT dingshilin studyonthethermalpropertiesandinsulationresistanceofepoxyresinmodifiedbyhexagonalboronnitride
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