Graphene and Carbon Nanotubes for Electronics Nanopackaging

In recent years, the aggressive downscaling of electronic components has led to highly dense and power-hungry devices. With Moore’s law expected to soon reach its physical limit, there is a pressing need to significantly improve the efficiency and performance not only of nanodevices, but...

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Autores principales:	Gabriele Boschetto, Stefania Carapezzi, Aida Todri-Sanial
Formato:	article
Lenguaje:	EN
Publicado:	IEEE 2021
Materias:	Carbon nanotube flexible electronics graphene interconnects nanopackaging thermal management Chemical technology TP1-1185 Electrical engineering. Electronics. Nuclear engineering TK1-9971
Acceso en línea:	https://doaj.org/article/bba9d8e90cb24606a6040d310b84b76d
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spelling	oai:doaj.org-article:bba9d8e90cb24606a6040d310b84b76d2021-12-04T00:00:17ZGraphene and Carbon Nanotubes for Electronics Nanopackaging2644-129210.1109/OJNANO.2021.3127652https://doaj.org/article/bba9d8e90cb24606a6040d310b84b76d2021-01-01T00:00:00Zhttps://ieeexplore.ieee.org/document/9613740/https://doaj.org/toc/2644-1292In recent years, the aggressive downscaling of electronic components has led to highly dense and power-hungry devices. With Moore’s law expected to soon reach its physical limit, there is a pressing need to significantly improve the efficiency and performance not only of nanodevices, but also of the embedding environment in which such nanodevices are integrated. In this context, key for improving the performance and for reducing both system cost and size is electronics packaging. However, electronics packaging at the nanoscale (i.e., nanopackaging) is currently facing several technological challenges, as in such scale conventional materials present intrinsic physical limitations. To address this, it becomes necessary to replace these latter with novel alternatives, such as low-dimensional carbon-based nanomaterials. Carbon nanotubes (CNTs) and graphene (materials with 1D and 2D dimensionality, respectively) have the potential to be successfully integrated into traditional silicon-based electronics as well as with beyond-silicon electronics, and their unique electrical, thermal, mechanical, and optical properties could be key enablers for significant performance improvements. In this short review we describe why these nanomaterials are very promising for electronics nanopackaging, and we outline the key application areas, mainly interconnects, thermal management, and flexible devices.Gabriele BoschettoStefania CarapezziAida Todri-SanialIEEEarticleCarbon nanotubeflexible electronicsgrapheneinterconnectsnanopackagingthermal managementChemical technologyTP1-1185Electrical engineering. Electronics. Nuclear engineeringTK1-9971ENIEEE Open Journal of Nanotechnology, Vol 2, Pp 120-128 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Carbon nanotube flexible electronics graphene interconnects nanopackaging thermal management Chemical technology TP1-1185 Electrical engineering. Electronics. Nuclear engineering TK1-9971
spellingShingle	Carbon nanotube flexible electronics graphene interconnects nanopackaging thermal management Chemical technology TP1-1185 Electrical engineering. Electronics. Nuclear engineering TK1-9971 Gabriele Boschetto Stefania Carapezzi Aida Todri-Sanial Graphene and Carbon Nanotubes for Electronics Nanopackaging
description	In recent years, the aggressive downscaling of electronic components has led to highly dense and power-hungry devices. With Moore’s law expected to soon reach its physical limit, there is a pressing need to significantly improve the efficiency and performance not only of nanodevices, but also of the embedding environment in which such nanodevices are integrated. In this context, key for improving the performance and for reducing both system cost and size is electronics packaging. However, electronics packaging at the nanoscale (i.e., nanopackaging) is currently facing several technological challenges, as in such scale conventional materials present intrinsic physical limitations. To address this, it becomes necessary to replace these latter with novel alternatives, such as low-dimensional carbon-based nanomaterials. Carbon nanotubes (CNTs) and graphene (materials with 1D and 2D dimensionality, respectively) have the potential to be successfully integrated into traditional silicon-based electronics as well as with beyond-silicon electronics, and their unique electrical, thermal, mechanical, and optical properties could be key enablers for significant performance improvements. In this short review we describe why these nanomaterials are very promising for electronics nanopackaging, and we outline the key application areas, mainly interconnects, thermal management, and flexible devices.
format	article
author	Gabriele Boschetto Stefania Carapezzi Aida Todri-Sanial
author_facet	Gabriele Boschetto Stefania Carapezzi Aida Todri-Sanial
author_sort	Gabriele Boschetto
title	Graphene and Carbon Nanotubes for Electronics Nanopackaging
title_short	Graphene and Carbon Nanotubes for Electronics Nanopackaging
title_full	Graphene and Carbon Nanotubes for Electronics Nanopackaging
title_fullStr	Graphene and Carbon Nanotubes for Electronics Nanopackaging
title_full_unstemmed	Graphene and Carbon Nanotubes for Electronics Nanopackaging
title_sort	graphene and carbon nanotubes for electronics nanopackaging
publisher	IEEE
publishDate	2021
url	https://doaj.org/article/bba9d8e90cb24606a6040d310b84b76d
work_keys_str_mv	AT gabrieleboschetto grapheneandcarbonnanotubesforelectronicsnanopackaging AT stefaniacarapezzi grapheneandcarbonnanotubesforelectronicsnanopackaging AT aidatodrisanial grapheneandcarbonnanotubesforelectronicsnanopackaging
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Graphene and Carbon Nanotubes for Electronics Nanopackaging

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