Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
To enhance the corrosion resistance of an aluminum (Al) 6082 alloy, our research used electroless deposition to coat a trio sequence of Zn–Cu–Sn layers: zinc, copper and tin. To isolate the reactions and micro-mechanisms in the tin coating, the Zn–Cu layering parameters of time, temperature, and bat...
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| Autores principales: | , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
KeAi Communications Co., Ltd.
2022
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/be0635d9eed246d19747ba511b9e2670 |
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| Sumario: | To enhance the corrosion resistance of an aluminum (Al) 6082 alloy, our research used electroless deposition to coat a trio sequence of Zn–Cu–Sn layers: zinc, copper and tin. To isolate the reactions and micro-mechanisms in the tin coating, the Zn–Cu layering parameters of time, temperature, and bath concentration were held constant while varying those during the Sn electroless deposition. Microstructures and layer thicknesses of the coated samples were studied using both optical and scanning electron microscopy (SEM). Local chemical compositions were analyzed using energy dispersive spectroscopy (EDS). Tin deposition on the Cu layer starts with a displacement reaction formed by the nucleation of discontinuous bulges that gradually grow into inhomogeneous crowns. During Sn deposition, surface Cu consumption and bath composition varies hindering access to displacement reactants, thus curtailing the significance of displacement. However, deposition continues via reduction and disproportionation directly tied to the solution. Peak layer quality was deposited at a temperature of 45 °C with a 1.5 times concentration for 1200 s. Anti-corrosion behavior of the Sn-coated sample was examined by Electrochemical Impedance Spectroscopy (EIS) to detect notable enhancement. |
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