Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy

To enhance the corrosion resistance of an aluminum (Al) 6082 alloy, our research used electroless deposition to coat a trio sequence of Zn–Cu–Sn layers: zinc, copper and tin. To isolate the reactions and micro-mechanisms in the tin coating, the Zn–Cu layering parameters of time, temperature, and bat...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Mohsen Moradi, Babak Gerami Shirazi, Alireza Sadeghi, Shahram Seidi
Formato:	article
Lenguaje:	EN
Publicado:	KeAi Communications Co., Ltd. 2022
Materias:	Electroless plating Multilayer metallic coating Aluminum alloy Corrosion resistance Technology T
Acceso en línea:	https://doaj.org/article/be0635d9eed246d19747ba511b9e2670
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:be0635d9eed246d19747ba511b9e2670
record_format	dspace
spelling	oai:doaj.org-article:be0635d9eed246d19747ba511b9e26702021-11-12T04:44:27ZElectroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy2588-840410.1016/j.ijlmm.2021.08.002https://doaj.org/article/be0635d9eed246d19747ba511b9e26702022-03-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S2588840421000378https://doaj.org/toc/2588-8404To enhance the corrosion resistance of an aluminum (Al) 6082 alloy, our research used electroless deposition to coat a trio sequence of Zn–Cu–Sn layers: zinc, copper and tin. To isolate the reactions and micro-mechanisms in the tin coating, the Zn–Cu layering parameters of time, temperature, and bath concentration were held constant while varying those during the Sn electroless deposition. Microstructures and layer thicknesses of the coated samples were studied using both optical and scanning electron microscopy (SEM). Local chemical compositions were analyzed using energy dispersive spectroscopy (EDS). Tin deposition on the Cu layer starts with a displacement reaction formed by the nucleation of discontinuous bulges that gradually grow into inhomogeneous crowns. During Sn deposition, surface Cu consumption and bath composition varies hindering access to displacement reactants, thus curtailing the significance of displacement. However, deposition continues via reduction and disproportionation directly tied to the solution. Peak layer quality was deposited at a temperature of 45 °C with a 1.5 times concentration for 1200 s. Anti-corrosion behavior of the Sn-coated sample was examined by Electrochemical Impedance Spectroscopy (EIS) to detect notable enhancement.Mohsen MoradiBabak Gerami ShiraziAlireza SadeghiShahram SeidiKeAi Communications Co., Ltd.articleElectroless platingMultilayer metallic coatingAluminum alloyCorrosion resistanceTechnologyTENInternational Journal of Lightweight Materials and Manufacture, Vol 5, Iss 1, Pp 1-10 (2022)
institution	DOAJ
collection	DOAJ
language	EN
topic	Electroless plating Multilayer metallic coating Aluminum alloy Corrosion resistance Technology T
spellingShingle	Electroless plating Multilayer metallic coating Aluminum alloy Corrosion resistance Technology T Mohsen Moradi Babak Gerami Shirazi Alireza Sadeghi Shahram Seidi Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
description	To enhance the corrosion resistance of an aluminum (Al) 6082 alloy, our research used electroless deposition to coat a trio sequence of Zn–Cu–Sn layers: zinc, copper and tin. To isolate the reactions and micro-mechanisms in the tin coating, the Zn–Cu layering parameters of time, temperature, and bath concentration were held constant while varying those during the Sn electroless deposition. Microstructures and layer thicknesses of the coated samples were studied using both optical and scanning electron microscopy (SEM). Local chemical compositions were analyzed using energy dispersive spectroscopy (EDS). Tin deposition on the Cu layer starts with a displacement reaction formed by the nucleation of discontinuous bulges that gradually grow into inhomogeneous crowns. During Sn deposition, surface Cu consumption and bath composition varies hindering access to displacement reactants, thus curtailing the significance of displacement. However, deposition continues via reduction and disproportionation directly tied to the solution. Peak layer quality was deposited at a temperature of 45 °C with a 1.5 times concentration for 1200 s. Anti-corrosion behavior of the Sn-coated sample was examined by Electrochemical Impedance Spectroscopy (EIS) to detect notable enhancement.
format	article
author	Mohsen Moradi Babak Gerami Shirazi Alireza Sadeghi Shahram Seidi
author_facet	Mohsen Moradi Babak Gerami Shirazi Alireza Sadeghi Shahram Seidi
author_sort	Mohsen Moradi
title	Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
title_short	Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
title_full	Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
title_fullStr	Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
title_full_unstemmed	Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy
title_sort	electroless plating of sn/cu/zn triple layer on aa6082 aluminum alloy
publisher	KeAi Communications Co., Ltd.
publishDate	2022
url	https://doaj.org/article/be0635d9eed246d19747ba511b9e2670
work_keys_str_mv	AT mohsenmoradi electrolessplatingofsncuzntriplelayeronaa6082aluminumalloy AT babakgeramishirazi electrolessplatingofsncuzntriplelayeronaa6082aluminumalloy AT alirezasadeghi electrolessplatingofsncuzntriplelayeronaa6082aluminumalloy AT shahramseidi electrolessplatingofsncuzntriplelayeronaa6082aluminumalloy
_version_	1718431255134994432

Electroless plating of Sn/Cu/Zn triple layer on AA6082 aluminum alloy

Ejemplares similares