Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber

This paper describes the development of a metal-core piezoelectric ceramics fiber/aluminum composite using a low cost hollow fiber. To develop this composite, this study applied a new fabrication process to fill the Al-Cu liquid phase alloy produced during the interphase forming/bonding (IF/B) metho...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Hiroshi ASANUMA, SUPRIANTO, Tetsuro YANASEKO, Jun KUNIKATA, Takamitsu CHIBA, Kiyoshi MIZUUCHI, Hiroshi SATO
Formato: article
Lenguaje:EN
Publicado: The Japan Society of Mechanical Engineers 2015
Materias:
Acceso en línea:https://doaj.org/article/be236cae7e3644c9b57c43bf41288b65
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
id oai:doaj.org-article:be236cae7e3644c9b57c43bf41288b65
record_format dspace
spelling oai:doaj.org-article:be236cae7e3644c9b57c43bf41288b652021-11-26T06:23:18ZFabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber2187-974510.1299/mej.14-00372https://doaj.org/article/be236cae7e3644c9b57c43bf41288b652015-03-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/2/2/2_14-00372/_pdf/-char/enhttps://doaj.org/toc/2187-9745This paper describes the development of a metal-core piezoelectric ceramics fiber/aluminum composite using a low cost hollow fiber. To develop this composite, this study applied a new fabrication process to fill the Al-Cu liquid phase alloy produced during the interphase forming/bonding (IF/B) method in the hollows. The IF/B method is a sophisticated transient liquid phase (TLP) bonding method developed to enable embedding fragile functional fibers at low temperature and low pressure in a short time period by using the eutectic reaction of inserting material and matrix. To increase the filling rate as well as removing the voids and the excessive Al-Cu alloy that remained in the matrix, the effects of the hot pressing temperature, the pressure, and the period were optimized in experiments. Under a hot pressing temperature of 873 K, a pressure of 2.2 MPa, and a period for 3.0 ks, the filling rate attained 99% without harmful chemical reactions between the fiber and the matrix, and the voids were successfully removed. In addition, it was clarified that the Al-Cu alloy core and the aluminum matrix worked as electrodes and that the embedded fiber could generate a relatively high output voltage, as well as the conventional metal-core piezoelectric ceramics fiber.Hiroshi ASANUMASUPRIANTOTetsuro YANASEKOJun KUNIKATATakamitsu CHIBAKiyoshi MIZUUCHIHiroshi SATOThe Japan Society of Mechanical Engineersarticlesmart materialsaluminum alloycomposite materialspiezoelectric ceramicssemimolten and semisolid processingMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 2, Iss 2, Pp 14-00372-14-00372 (2015)
institution DOAJ
collection DOAJ
language EN
topic smart materials
aluminum alloy
composite materials
piezoelectric ceramics
semimolten and semisolid processing
Mechanical engineering and machinery
TJ1-1570
spellingShingle smart materials
aluminum alloy
composite materials
piezoelectric ceramics
semimolten and semisolid processing
Mechanical engineering and machinery
TJ1-1570
Hiroshi ASANUMA
SUPRIANTO
Tetsuro YANASEKO
Jun KUNIKATA
Takamitsu CHIBA
Kiyoshi MIZUUCHI
Hiroshi SATO
Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
description This paper describes the development of a metal-core piezoelectric ceramics fiber/aluminum composite using a low cost hollow fiber. To develop this composite, this study applied a new fabrication process to fill the Al-Cu liquid phase alloy produced during the interphase forming/bonding (IF/B) method in the hollows. The IF/B method is a sophisticated transient liquid phase (TLP) bonding method developed to enable embedding fragile functional fibers at low temperature and low pressure in a short time period by using the eutectic reaction of inserting material and matrix. To increase the filling rate as well as removing the voids and the excessive Al-Cu alloy that remained in the matrix, the effects of the hot pressing temperature, the pressure, and the period were optimized in experiments. Under a hot pressing temperature of 873 K, a pressure of 2.2 MPa, and a period for 3.0 ks, the filling rate attained 99% without harmful chemical reactions between the fiber and the matrix, and the voids were successfully removed. In addition, it was clarified that the Al-Cu alloy core and the aluminum matrix worked as electrodes and that the embedded fiber could generate a relatively high output voltage, as well as the conventional metal-core piezoelectric ceramics fiber.
format article
author Hiroshi ASANUMA
SUPRIANTO
Tetsuro YANASEKO
Jun KUNIKATA
Takamitsu CHIBA
Kiyoshi MIZUUCHI
Hiroshi SATO
author_facet Hiroshi ASANUMA
SUPRIANTO
Tetsuro YANASEKO
Jun KUNIKATA
Takamitsu CHIBA
Kiyoshi MIZUUCHI
Hiroshi SATO
author_sort Hiroshi ASANUMA
title Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
title_short Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
title_full Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
title_fullStr Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
title_full_unstemmed Fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
title_sort fabrication of an aluminum matrix piezocomposite using hollow piezoelectric fiber
publisher The Japan Society of Mechanical Engineers
publishDate 2015
url https://doaj.org/article/be236cae7e3644c9b57c43bf41288b65
work_keys_str_mv AT hiroshiasanuma fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
AT suprianto fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
AT tetsuroyanaseko fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
AT junkunikata fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
AT takamitsuchiba fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
AT kiyoshimizuuchi fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
AT hiroshisato fabricationofanaluminummatrixpiezocompositeusinghollowpiezoelectricfiber
_version_ 1718409805745356800