Wei, H., Chuang, S., & Chen, C. (2021). Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG.
Chicago Style (17th ed.) CitationWei, Hung-Wen, Shao-Ming Chuang, and Chen-Sheng Chen. Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG, 2021.
MLA (8th ed.) CitationWei, Hung-Wen, et al. Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG, 2021.
Warning: These citations may not always be 100% accurate.