Cita APA (7a ed.)

Wei, H., Chuang, S., & Chen, C. (2021). Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG.

Cita Chicago Style (17a ed.)

Wei, Hung-Wen, Shao-Ming Chuang, y Chen-Sheng Chen. Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG, 2021.

Cita MLA (8a ed.)

Wei, Hung-Wen, et al. Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG, 2021.