Wei, H., Chuang, S., & Chen, C. (2021). Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG.
Style de citation Chicago (17e éd.)Wei, Hung-Wen, Shao-Ming Chuang, et Chen-Sheng Chen. Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG, 2021.
Style de citation MLA (8e éd.)Wei, Hung-Wen, et al. Biomechanical Evaluation of the Lumbar Spine by Using a New Interspinous Process Device: A Finite Element Analysis. MDPI AG, 2021.
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