Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface

The Kirkendall effect can lead to detrimental voids in nanomaterials used in nanoelectronic devices, and its control remains elusive. Here, the authors introduce dense nanoscale twins in copper nanowires and modify their surface to prohibit Kirkendall void formation during nanowire oxidation.

Guardado en:

Detalles Bibliográficos
Autores principales:	Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao, K. N. Tu
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/bff788dcdabc4641a8f6b3e36e0275c6
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:bff788dcdabc4641a8f6b3e36e0275c6
record_format	dspace
spelling	oai:doaj.org-article:bff788dcdabc4641a8f6b3e36e0275c62021-12-02T14:41:16ZSuppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface10.1038/s41467-017-02154-32041-1723https://doaj.org/article/bff788dcdabc4641a8f6b3e36e0275c62018-01-01T00:00:00Zhttps://doi.org/10.1038/s41467-017-02154-3https://doaj.org/toc/2041-1723The Kirkendall effect can lead to detrimental voids in nanomaterials used in nanoelectronic devices, and its control remains elusive. Here, the authors introduce dense nanoscale twins in copper nanowires and modify their surface to prohibit Kirkendall void formation during nanowire oxidation.Chun-Lung HuangWei-Lun WengChien-Neng LiaoK. N. TuNature PortfolioarticleScienceQENNature Communications, Vol 9, Iss 1, Pp 1-7 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Chun-Lung Huang Wei-Lun Weng Chien-Neng Liao K. N. Tu Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
description	The Kirkendall effect can lead to detrimental voids in nanomaterials used in nanoelectronic devices, and its control remains elusive. Here, the authors introduce dense nanoscale twins in copper nanowires and modify their surface to prohibit Kirkendall void formation during nanowire oxidation.
format	article
author	Chun-Lung Huang Wei-Lun Weng Chien-Neng Liao K. N. Tu
author_facet	Chun-Lung Huang Wei-Lun Weng Chien-Neng Liao K. N. Tu
author_sort	Chun-Lung Huang
title	Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
title_short	Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
title_full	Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
title_fullStr	Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
title_full_unstemmed	Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
title_sort	suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/bff788dcdabc4641a8f6b3e36e0275c6
work_keys_str_mv	AT chunlunghuang suppressionofinterdiffusioninducedvoidinginoxidationofcoppernanowireswithtwinmodifiedsurface AT weilunweng suppressionofinterdiffusioninducedvoidinginoxidationofcoppernanowireswithtwinmodifiedsurface AT chiennengliao suppressionofinterdiffusioninducedvoidinginoxidationofcoppernanowireswithtwinmodifiedsurface AT kntu suppressionofinterdiffusioninducedvoidinginoxidationofcoppernanowireswithtwinmodifiedsurface
_version_	1718389957655003136

Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface

Ejemplares similares