Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the pl...
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| Autores principales: | , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/c3243841b204422b9cf565344afbb610 |
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| Sumario: | Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the plating works smoothly. Since the bubbles are generated randomly and everywhere, a volume-averaged, two-phase, two-velocity, one pressure-flow model is applied. This fluid system is coupled with a set of convection–diffusion equations for the chemicals subject to flux boundary conditions for electron balance. The moving boundary due to plating is considered. The Galerkin-characteristic finite element method is used for temporal and spatial discretizations; the well-posedness of the numerical scheme is proved. Numerical studies in two dimensions are performed to validate the model against earlier one-dimensional models and a dedicated experiment that has been set up to visualize the distribution of bubbles. |
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