Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow

Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the pl...

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Autores principales: Po-Yi Wu, Olivier Pironneau, Po-Shao Shih, ChengHeng Robert Kao
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Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/c3243841b204422b9cf565344afbb610
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spelling oai:doaj.org-article:c3243841b204422b9cf565344afbb6102021-11-25T17:31:22ZNumerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow10.3390/fluids61103712311-5521https://doaj.org/article/c3243841b204422b9cf565344afbb6102021-10-01T00:00:00Zhttps://www.mdpi.com/2311-5521/6/11/371https://doaj.org/toc/2311-5521Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the plating works smoothly. Since the bubbles are generated randomly and everywhere, a volume-averaged, two-phase, two-velocity, one pressure-flow model is applied. This fluid system is coupled with a set of convection–diffusion equations for the chemicals subject to flux boundary conditions for electron balance. The moving boundary due to plating is considered. The Galerkin-characteristic finite element method is used for temporal and spatial discretizations; the well-posedness of the numerical scheme is proved. Numerical studies in two dimensions are performed to validate the model against earlier one-dimensional models and a dedicated experiment that has been set up to visualize the distribution of bubbles.Po-Yi WuOlivier PironneauPo-Shao ShihChengHeng Robert KaoMDPI AGarticleelectroless plating processtwo-phase flowfinite element methodtwo-velocities averaged modelThermodynamicsQC310.15-319Descriptive and experimental mechanicsQC120-168.85ENFluids, Vol 6, Iss 371, p 371 (2021)
institution DOAJ
collection DOAJ
language EN
topic electroless plating process
two-phase flow
finite element method
two-velocities averaged model
Thermodynamics
QC310.15-319
Descriptive and experimental mechanics
QC120-168.85
spellingShingle electroless plating process
two-phase flow
finite element method
two-velocities averaged model
Thermodynamics
QC310.15-319
Descriptive and experimental mechanics
QC120-168.85
Po-Yi Wu
Olivier Pironneau
Po-Shao Shih
ChengHeng Robert Kao
Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
description Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the plating works smoothly. Since the bubbles are generated randomly and everywhere, a volume-averaged, two-phase, two-velocity, one pressure-flow model is applied. This fluid system is coupled with a set of convection–diffusion equations for the chemicals subject to flux boundary conditions for electron balance. The moving boundary due to plating is considered. The Galerkin-characteristic finite element method is used for temporal and spatial discretizations; the well-posedness of the numerical scheme is proved. Numerical studies in two dimensions are performed to validate the model against earlier one-dimensional models and a dedicated experiment that has been set up to visualize the distribution of bubbles.
format article
author Po-Yi Wu
Olivier Pironneau
Po-Shao Shih
ChengHeng Robert Kao
author_facet Po-Yi Wu
Olivier Pironneau
Po-Shao Shih
ChengHeng Robert Kao
author_sort Po-Yi Wu
title Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
title_short Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
title_full Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
title_fullStr Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
title_full_unstemmed Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
title_sort numerical analysis of an electroless plating problem in gas–liquid two-phase flow
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/c3243841b204422b9cf565344afbb610
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AT olivierpironneau numericalanalysisofanelectrolessplatingproblemingasliquidtwophaseflow
AT poshaoshih numericalanalysisofanelectrolessplatingproblemingasliquidtwophaseflow
AT chenghengrobertkao numericalanalysisofanelectrolessplatingproblemingasliquidtwophaseflow
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