Thermo-Optic Phase Tuners Analysis and Design for Process Modules on a Silicon Nitride Platform
In this paper, we present a systematic design for manufacturing analysis for thermo-optic phase tuners, framed within the process modules available on a silicon nitride platform. Departing from an established technology platform, the heat distribution in various micro-structures was analyzed, both i...
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| Autores principales: | , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/c43a7a0b733d4ad38552baa6cb5d02f1 |
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| Sumario: | In this paper, we present a systematic design for manufacturing analysis for thermo-optic phase tuners, framed within the process modules available on a silicon nitride platform. Departing from an established technology platform, the heat distribution in various micro-structures was analyzed, both in steady and transient states, employing a 2D heat transfer model solved numerically. Multi-parametric simulations were performed on designs combining trenches and substrate undercut, by varying their position and dimensions. The simulation results were compared to a reference conventional fully-clad cross-section. Deep air-filled trenches are shown to reduce the power consumption up to 70%, alongside a thermal crosstalk phase shift reduction of more than one order of magnitude (0.045 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi>π</mi></semantics></math></inline-formula> rad/mm), at the expense of a slightly lower bandwidth (11.8 kHz). The design with trenches and substrate undercut lowers the power consumption up to 97%, decreases two orders of magnitude the crosstalk (0.006 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi>π</mi></semantics></math></inline-formula> rad/mm), at the cost of less than one order of magnitude in bandwidth (0.9 kHz). In the works, we selected three different heater materials (Cr/Au, Al, poly-silicon) offered by the fab and four different heater widths (2.5 to 7 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m). Their combinations are related to performance, reliability and durability of the devices, strongly linked to temperature, current density, and Omegaic resistance. The different figures of merit defined, and the methodology followed, can be mimicked by future designers to take design decisions at bird’s eye. |
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