Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction

Unidirectional friction experiments on uniaxially compressed pure Cu powder were performed to clarify how the solid-phase interparticle bonding proceeds during a powder molding method by applying biaxial force, termed as a compression shearing method at room temperature. Relations among the applied...

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Autores principales:	Sho Takeda, Hiroyuki Miki, Julien Fontaine, Matthieu Guibert, Hiroyuku Takeishi, Toshiyuki Takagi
Formato:	article
Lenguaje:	EN
Publicado:	Japanese Society of Tribologists 2018
Materias:	copper powder molding friction and wear unidirectional friction experiment stress distribution Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999
Acceso en línea:	https://doaj.org/article/c48f45424b474c219c5ddb80bc839ed4
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spelling	oai:doaj.org-article:c48f45424b474c219c5ddb80bc839ed42021-11-05T09:19:22ZInterparticle Bonding of Cu Powder under Repetitive Unidirectional Friction1881-219810.2474/trol.13.43https://doaj.org/article/c48f45424b474c219c5ddb80bc839ed42018-05-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/trol/13/2/13_43/_pdf/-char/enhttps://doaj.org/toc/1881-2198Unidirectional friction experiments on uniaxially compressed pure Cu powder were performed to clarify how the solid-phase interparticle bonding proceeds during a powder molding method by applying biaxial force, termed as a compression shearing method at room temperature. Relations among the applied normal load, number of sliding cycles, and microstructural changes of the powder particles were investigated by morphological and cross-sectional observations of the samples after the friction experiments. The structural observations revealed some layered regions with different microstructures within the sample cross-section. All regions increased in size at a higher applied normal load, but their size did not change as the number of the sliding cycles increased. This phenomenon was quantitatively explained by Hamilton and Goodman’s model, which showed that the applied normal load correlated with the stress distribution applied to the sample. Tensile stress applied to the powder particles along the sliding direction appeared to be most effective for interparticle bonding. In addition, it was suggested that the bonding process of the powder particles proceeded through the steps: (1) plastic deformation; (2) initially crystal grain refinement to micrometer size; (3) bonding by local sliding between powder particles; and (4) crystal grain refinement to sub-micrometer size.Sho TakedaHiroyuki MikiJulien FontaineMatthieu GuibertHiroyuku TakeishiToshiyuki TakagiJapanese Society of Tribologistsarticlecopperpowder moldingfriction and wearunidirectional friction experimentstress distributionPhysicsQC1-999Engineering (General). Civil engineering (General)TA1-2040Mechanical engineering and machineryTJ1-1570ChemistryQD1-999ENTribology Online, Vol 13, Iss 2, Pp 43-49 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	copper powder molding friction and wear unidirectional friction experiment stress distribution Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999
spellingShingle	copper powder molding friction and wear unidirectional friction experiment stress distribution Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999 Sho Takeda Hiroyuki Miki Julien Fontaine Matthieu Guibert Hiroyuku Takeishi Toshiyuki Takagi Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
description	Unidirectional friction experiments on uniaxially compressed pure Cu powder were performed to clarify how the solid-phase interparticle bonding proceeds during a powder molding method by applying biaxial force, termed as a compression shearing method at room temperature. Relations among the applied normal load, number of sliding cycles, and microstructural changes of the powder particles were investigated by morphological and cross-sectional observations of the samples after the friction experiments. The structural observations revealed some layered regions with different microstructures within the sample cross-section. All regions increased in size at a higher applied normal load, but their size did not change as the number of the sliding cycles increased. This phenomenon was quantitatively explained by Hamilton and Goodman’s model, which showed that the applied normal load correlated with the stress distribution applied to the sample. Tensile stress applied to the powder particles along the sliding direction appeared to be most effective for interparticle bonding. In addition, it was suggested that the bonding process of the powder particles proceeded through the steps: (1) plastic deformation; (2) initially crystal grain refinement to micrometer size; (3) bonding by local sliding between powder particles; and (4) crystal grain refinement to sub-micrometer size.
format	article
author	Sho Takeda Hiroyuki Miki Julien Fontaine Matthieu Guibert Hiroyuku Takeishi Toshiyuki Takagi
author_facet	Sho Takeda Hiroyuki Miki Julien Fontaine Matthieu Guibert Hiroyuku Takeishi Toshiyuki Takagi
author_sort	Sho Takeda
title	Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
title_short	Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
title_full	Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
title_fullStr	Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
title_full_unstemmed	Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction
title_sort	interparticle bonding of cu powder under repetitive unidirectional friction
publisher	Japanese Society of Tribologists
publishDate	2018
url	https://doaj.org/article/c48f45424b474c219c5ddb80bc839ed4
work_keys_str_mv	AT shotakeda interparticlebondingofcupowderunderrepetitiveunidirectionalfriction AT hiroyukimiki interparticlebondingofcupowderunderrepetitiveunidirectionalfriction AT julienfontaine interparticlebondingofcupowderunderrepetitiveunidirectionalfriction AT matthieuguibert interparticlebondingofcupowderunderrepetitiveunidirectionalfriction AT hiroyukutakeishi interparticlebondingofcupowderunderrepetitiveunidirectionalfriction AT toshiyukitakagi interparticlebondingofcupowderunderrepetitiveunidirectionalfriction
_version_	1718444435235143680

Interparticle Bonding of Cu Powder under Repetitive Unidirectional Friction

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