Effects of polyimide curing on image sticking behaviors of flexible displays

Abstract Flexible displays on a polyimide (PI) substrate are widely regarded as a promising next-generation display technology due to their versatility in various applications. Among other bendable materials used as display panel substrates, PI is especially suitable for flexible displays for its hi...

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Autores principales:	Hyojung Kim, Jongwoo Park, Sora Bak, Jungmin Park, Changwoo Byun, Changyong Oh, Bo Sung Kim, Chanhee Han, Jongmin Yoo, Dongbhin Kim, Jangkun Song, Pyungho Choi, Byoungdeog Choi
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/c4c6ba3e77ca44da8f624dbeb4fd4a2b
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spelling	oai:doaj.org-article:c4c6ba3e77ca44da8f624dbeb4fd4a2b2021-11-14T12:19:25ZEffects of polyimide curing on image sticking behaviors of flexible displays10.1038/s41598-021-01364-62045-2322https://doaj.org/article/c4c6ba3e77ca44da8f624dbeb4fd4a2b2021-11-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-01364-6https://doaj.org/toc/2045-2322Abstract Flexible displays on a polyimide (PI) substrate are widely regarded as a promising next-generation display technology due to their versatility in various applications. Among other bendable materials used as display panel substrates, PI is especially suitable for flexible displays for its high glass transition temperature and low coefficient of thermal expansion. PI cured under various temperatures (260 °C, 360 °C, and 460 °C) was implemented in metal–insulator–metal (MIM) capacitors, amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFT), and actual display panels to analyze device stability and panel product characteristics. Through electrical analysis of the MIM capacitor, it was confirmed that the charging effect in the PI substrates intensified as the PI curing temperature increased. The threshold voltage shift (ΔVth) of the samples was found to increase with rising curing temperature under negative bias temperature stress (NBTS) due to the charging effect. Our analyses also show that increasing ΔVth exacerbates the image sticking phenomenon observed in display panels. These findings ultimately present a direct correlation between the curing temperature of polyimide substrates and the panel image sticking phenomenon, which could provide an insight into the improvement of future PI-substrate-based displays.Hyojung KimJongwoo ParkSora BakJungmin ParkChangwoo ByunChangyong OhBo Sung KimChanhee HanJongmin YooDongbhin KimJangkun SongPyungho ChoiByoungdeog ChoiNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Hyojung Kim Jongwoo Park Sora Bak Jungmin Park Changwoo Byun Changyong Oh Bo Sung Kim Chanhee Han Jongmin Yoo Dongbhin Kim Jangkun Song Pyungho Choi Byoungdeog Choi Effects of polyimide curing on image sticking behaviors of flexible displays
description	Abstract Flexible displays on a polyimide (PI) substrate are widely regarded as a promising next-generation display technology due to their versatility in various applications. Among other bendable materials used as display panel substrates, PI is especially suitable for flexible displays for its high glass transition temperature and low coefficient of thermal expansion. PI cured under various temperatures (260 °C, 360 °C, and 460 °C) was implemented in metal–insulator–metal (MIM) capacitors, amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFT), and actual display panels to analyze device stability and panel product characteristics. Through electrical analysis of the MIM capacitor, it was confirmed that the charging effect in the PI substrates intensified as the PI curing temperature increased. The threshold voltage shift (ΔVth) of the samples was found to increase with rising curing temperature under negative bias temperature stress (NBTS) due to the charging effect. Our analyses also show that increasing ΔVth exacerbates the image sticking phenomenon observed in display panels. These findings ultimately present a direct correlation between the curing temperature of polyimide substrates and the panel image sticking phenomenon, which could provide an insight into the improvement of future PI-substrate-based displays.
format	article
author	Hyojung Kim Jongwoo Park Sora Bak Jungmin Park Changwoo Byun Changyong Oh Bo Sung Kim Chanhee Han Jongmin Yoo Dongbhin Kim Jangkun Song Pyungho Choi Byoungdeog Choi
author_facet	Hyojung Kim Jongwoo Park Sora Bak Jungmin Park Changwoo Byun Changyong Oh Bo Sung Kim Chanhee Han Jongmin Yoo Dongbhin Kim Jangkun Song Pyungho Choi Byoungdeog Choi
author_sort	Hyojung Kim
title	Effects of polyimide curing on image sticking behaviors of flexible displays
title_short	Effects of polyimide curing on image sticking behaviors of flexible displays
title_full	Effects of polyimide curing on image sticking behaviors of flexible displays
title_fullStr	Effects of polyimide curing on image sticking behaviors of flexible displays
title_full_unstemmed	Effects of polyimide curing on image sticking behaviors of flexible displays
title_sort	effects of polyimide curing on image sticking behaviors of flexible displays
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/c4c6ba3e77ca44da8f624dbeb4fd4a2b
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Effects of polyimide curing on image sticking behaviors of flexible displays

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