Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition

Abstract The design of multifunctional alloys with multiple chemical components requires controllable synthesis approaches. Physical vapor deposition techniques, which result in thin films (<1 μm), have previously been demonstrated for micromechanical devices and metallic combinatorial libraries....

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Autores principales:	Yijia Zhang, Patrick J. Shamberger
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/ca87db80447f4b9a889bd134f55928f5
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spelling	oai:doaj.org-article:ca87db80447f4b9a889bd134f55928f52021-12-02T15:08:00ZThick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition10.1038/s41598-018-29628-82045-2322https://doaj.org/article/ca87db80447f4b9a889bd134f55928f52018-08-01T00:00:00Zhttps://doi.org/10.1038/s41598-018-29628-8https://doaj.org/toc/2045-2322Abstract The design of multifunctional alloys with multiple chemical components requires controllable synthesis approaches. Physical vapor deposition techniques, which result in thin films (<1 μm), have previously been demonstrated for micromechanical devices and metallic combinatorial libraries. However, this approach deviates from bulk-like properties due to the residual stress derived in thin films and is limited by total film thickness. Here, we report a route to obtain ternary Ni-Mn-Sn alloy thick films with controllable compositions and thicknesses by annealing electrochemically deposited multi-layer monatomic (Ni, Mn, Sn) films, deposited sequentially from separate aqueous deposition baths. We demonstrate (1) controllable compositions, with high degree of uniformity, (2) smooth films, and (3) high reproducibility between film transformation behavior. Our results demonstrate a positive correlation between alloy film thicknesses and grain sizes, as well as consistent bulk-like transformation behavior.Yijia ZhangPatrick J. ShambergerNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 8, Iss 1, Pp 1-13 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Yijia Zhang Patrick J. Shamberger Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
description	Abstract The design of multifunctional alloys with multiple chemical components requires controllable synthesis approaches. Physical vapor deposition techniques, which result in thin films (<1 μm), have previously been demonstrated for micromechanical devices and metallic combinatorial libraries. However, this approach deviates from bulk-like properties due to the residual stress derived in thin films and is limited by total film thickness. Here, we report a route to obtain ternary Ni-Mn-Sn alloy thick films with controllable compositions and thicknesses by annealing electrochemically deposited multi-layer monatomic (Ni, Mn, Sn) films, deposited sequentially from separate aqueous deposition baths. We demonstrate (1) controllable compositions, with high degree of uniformity, (2) smooth films, and (3) high reproducibility between film transformation behavior. Our results demonstrate a positive correlation between alloy film thicknesses and grain sizes, as well as consistent bulk-like transformation behavior.
format	article
author	Yijia Zhang Patrick J. Shamberger
author_facet	Yijia Zhang Patrick J. Shamberger
author_sort	Yijia Zhang
title	Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_short	Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_full	Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_fullStr	Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_full_unstemmed	Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition
title_sort	thick film ni0.5mn0.5−xsnx heusler alloys by multi-layer electrochemical deposition
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/ca87db80447f4b9a889bd134f55928f5
work_keys_str_mv	AT yijiazhang thickfilmni05mn05xsnxheusleralloysbymultilayerelectrochemicaldeposition AT patrickjshamberger thickfilmni05mn05xsnxheusleralloysbymultilayerelectrochemicaldeposition
_version_	1718388348356132864

Thick Film Ni0.5Mn0.5−xSnx Heusler Alloys by Multi-layer Electrochemical Deposition

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