Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method

Abstract Electrochemical strain microscopy (ESM) has been developed with the aim of measuring Vegard strains in mixed ionic-electronic conductors (MIECs), such as electrode materials for Li-ion batteries, caused by local changes in the chemical composition. In this technique, a voltage-biased AFM ti...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Sebastian Badur, Diemo Renz, Marvin Cronau, Thomas Göddenhenrich, Dirk Dietzel, Bernhard Roling, André Schirmeisen
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/d0383806332c42c3a103e9bc1a04d49a
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:d0383806332c42c3a103e9bc1a04d49a
record_format	dspace
spelling	oai:doaj.org-article:d0383806332c42c3a103e9bc1a04d49a2021-12-02T18:33:46ZCharacterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method10.1038/s41598-021-96602-22045-2322https://doaj.org/article/d0383806332c42c3a103e9bc1a04d49a2021-09-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-96602-2https://doaj.org/toc/2045-2322Abstract Electrochemical strain microscopy (ESM) has been developed with the aim of measuring Vegard strains in mixed ionic-electronic conductors (MIECs), such as electrode materials for Li-ion batteries, caused by local changes in the chemical composition. In this technique, a voltage-biased AFM tip is used in contact resonance mode. However, extracting quantitative strain information from ESM experiments is highly challenging due to the complexity of the signal generation process. In particular, electrostatic interactions between tip and sample contribute significantly to the measured ESM signals, and the separation of Vegard strain-induced signal contributions from electrostatically induced signal contributions is by no means a trivial task. Recently, we have published a compensation method for eliminating frequency-independent electrostatic contributions in ESM measurements. Here, we demonstrate the potential of this method for detecting Vegard strain in MIECs by choosing Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 as a model-type MIEC with an exceptionally high Cu chemical diffusion coefficient. Even for this material, Vegard strains are only measurable around and above room-temperature and with proper elimination of electrostatics. The analyis of the measured Vegards strains gives strong indication that due to a high charge transfer resistance at the tip/interface, the local Cu concentration variations are much smaller than predicted by the local Nernst equation. This suggests that charge transfer resistances have to be analyzed in more detail in future ESM studies.Sebastian BadurDiemo RenzMarvin CronauThomas GöddenhenrichDirk DietzelBernhard RolingAndré SchirmeisenNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Sebastian Badur Diemo Renz Marvin Cronau Thomas Göddenhenrich Dirk Dietzel Bernhard Roling André Schirmeisen Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method
description	Abstract Electrochemical strain microscopy (ESM) has been developed with the aim of measuring Vegard strains in mixed ionic-electronic conductors (MIECs), such as electrode materials for Li-ion batteries, caused by local changes in the chemical composition. In this technique, a voltage-biased AFM tip is used in contact resonance mode. However, extracting quantitative strain information from ESM experiments is highly challenging due to the complexity of the signal generation process. In particular, electrostatic interactions between tip and sample contribute significantly to the measured ESM signals, and the separation of Vegard strain-induced signal contributions from electrostatically induced signal contributions is by no means a trivial task. Recently, we have published a compensation method for eliminating frequency-independent electrostatic contributions in ESM measurements. Here, we demonstrate the potential of this method for detecting Vegard strain in MIECs by choosing Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 as a model-type MIEC with an exceptionally high Cu chemical diffusion coefficient. Even for this material, Vegard strains are only measurable around and above room-temperature and with proper elimination of electrostatics. The analyis of the measured Vegards strains gives strong indication that due to a high charge transfer resistance at the tip/interface, the local Cu concentration variations are much smaller than predicted by the local Nernst equation. This suggests that charge transfer resistances have to be analyzed in more detail in future ESM studies.
format	article
author	Sebastian Badur Diemo Renz Marvin Cronau Thomas Göddenhenrich Dirk Dietzel Bernhard Roling André Schirmeisen
author_facet	Sebastian Badur Diemo Renz Marvin Cronau Thomas Göddenhenrich Dirk Dietzel Bernhard Roling André Schirmeisen
author_sort	Sebastian Badur
title	Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method
title_short	Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method
title_full	Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method
title_fullStr	Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method
title_full_unstemmed	Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method
title_sort	characterization of vegard strain related to exceptionally fast cu-chemical diffusion in cu $$_2$$ 2 mo $$_6$$ 6 s $$_8$$ 8 by an advanced electrochemical strain microscopy method
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/d0383806332c42c3a103e9bc1a04d49a
work_keys_str_mv	AT sebastianbadur characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod AT diemorenz characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod AT marvincronau characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod AT thomasgoddenhenrich characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod AT dirkdietzel characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod AT bernhardroling characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod AT andreschirmeisen characterizationofvegardstrainrelatedtoexceptionallyfastcuchemicaldiffusionincu22mo66s88byanadvancedelectrochemicalstrainmicroscopymethod
_version_	1718377947212021760

Characterization of Vegard strain related to exceptionally fast Cu-chemical diffusion in Cu $$_2$$ 2 Mo $$_6$$ 6 S $$_8$$ 8 by an advanced electrochemical strain microscopy method

Ejemplares similares