Resistance to temperature and humidity changes of construction plywood and thermal-insulation boards
Plywood and thermal-insulation boards with phenol-formaldehyde binder (PF), like other composites for construction purposes, must have long-term strength with changing temperature and humidity. The insufficient degree of curing of the phenol-formaldehyde binder reduces the hydrolytic stability of th...
Guardado en:
Autores principales: | Fedotov Alexander, Vahnina Tatiana, Susoeva Irina |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
Peter the Great St. Petersburg Polytechnic University
2021
|
Materias: | |
Acceso en línea: | https://doaj.org/article/d03fbdf25d314cf9a77f1a666d2c6e1a |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
Ejemplares similares
-
The effect of oxidation of wood particles on the usage quantity of adhesive and study the physical and mechanical properties of single layer particle board
por: parisa azari, et al.
Publicado: (2014) -
Análisis Térmico y Propiedades Adhesivas de Resinas Fenol-Resorcinol-Formaldehído
por: Lisperguer,J. H, et al.
Publicado: (2005) -
Construction of Particlboard Using Tannin-Based Phenol Adhesive
por: ُSima Sepahvand, et al.
Publicado: (2012) -
Resistance improvement of rubberwood treated with zinc oxide nanoparticles and phenolic resin against white-rot fungi, Pycnoporus sanguineus
por: Uyup,Mohd Khairun Anwar, et al.
Publicado: (2019) -
Effect of humidity on diameter of polyamide 6 nanofiber in electrospinning process
por: Kazuto TANAKA, et al.
Publicado: (2016)