Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder

To save test time and cost, spreading area method and wetting balance method were used to study the wetting characteristics of Ni-GNSs/SnAgCuRE composite solder under different parameters and explore the correlation between spreadability and wetting driving force of the composite solder. The results...

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Autores principales: Huigai Wang, Keke Zhang, Yongjin Wu, Bingying Wang
Formato: article
Lenguaje:EN
Publicado: Elsevier 2021
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spelling oai:doaj.org-article:d589da5800a94e5eb460d85aa563f1692021-11-14T04:28:32ZStudy on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder0264-127510.1016/j.matdes.2021.110222https://doaj.org/article/d589da5800a94e5eb460d85aa563f1692021-12-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S0264127521007772https://doaj.org/toc/0264-1275To save test time and cost, spreading area method and wetting balance method were used to study the wetting characteristics of Ni-GNSs/SnAgCuRE composite solder under different parameters and explore the correlation between spreadability and wetting driving force of the composite solder. The results showed that the composite solder had good spreadability on the Cu substrate under 270–280 °C and water-clean flux, and they had good wetting adaptability to Cu wire under the tin bath temperature of 270–280 °C, dipping time of 6 s and dipping speed of 20 mm/s. The results satisfied the requirements of production in micro-connection field. The dynamic spreading processes of Ni-GNSs/SnAgCuRE composite solder consisted of three stages: initial slow shrinkage, rapid expansion and gradual equilibrium. Added appropriate amount of Ni-GNSs into the solder alloy, they adsorbed on the surface of Ag3Sn particles to form a precursor film at the three-phase interface, which was conducive to spread. The correlation equation between spreadability and wetting driving force of composite solder was established. According to the spreading area of the composite solder on the Cu substrate, the wetting driving force and wetting balance of the immersion wetting processes could be analyzed and vice versa.Huigai WangKeke ZhangYongjin WuBingying WangElsevierarticleNi-GNSs/SnAgCuRE composite solderWetting characteristicsSpreadabilityWetting driving forceCorrelationMaterials of engineering and construction. Mechanics of materialsTA401-492ENMaterials & Design, Vol 212, Iss , Pp 110222- (2021)
institution DOAJ
collection DOAJ
language EN
topic Ni-GNSs/SnAgCuRE composite solder
Wetting characteristics
Spreadability
Wetting driving force
Correlation
Materials of engineering and construction. Mechanics of materials
TA401-492
spellingShingle Ni-GNSs/SnAgCuRE composite solder
Wetting characteristics
Spreadability
Wetting driving force
Correlation
Materials of engineering and construction. Mechanics of materials
TA401-492
Huigai Wang
Keke Zhang
Yongjin Wu
Bingying Wang
Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
description To save test time and cost, spreading area method and wetting balance method were used to study the wetting characteristics of Ni-GNSs/SnAgCuRE composite solder under different parameters and explore the correlation between spreadability and wetting driving force of the composite solder. The results showed that the composite solder had good spreadability on the Cu substrate under 270–280 °C and water-clean flux, and they had good wetting adaptability to Cu wire under the tin bath temperature of 270–280 °C, dipping time of 6 s and dipping speed of 20 mm/s. The results satisfied the requirements of production in micro-connection field. The dynamic spreading processes of Ni-GNSs/SnAgCuRE composite solder consisted of three stages: initial slow shrinkage, rapid expansion and gradual equilibrium. Added appropriate amount of Ni-GNSs into the solder alloy, they adsorbed on the surface of Ag3Sn particles to form a precursor film at the three-phase interface, which was conducive to spread. The correlation equation between spreadability and wetting driving force of composite solder was established. According to the spreading area of the composite solder on the Cu substrate, the wetting driving force and wetting balance of the immersion wetting processes could be analyzed and vice versa.
format article
author Huigai Wang
Keke Zhang
Yongjin Wu
Bingying Wang
author_facet Huigai Wang
Keke Zhang
Yongjin Wu
Bingying Wang
author_sort Huigai Wang
title Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
title_short Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
title_full Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
title_fullStr Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
title_full_unstemmed Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
title_sort study on the correlation between spreadability and wetting driving force of ni-gnss reinforced snagcure composite solder
publisher Elsevier
publishDate 2021
url https://doaj.org/article/d589da5800a94e5eb460d85aa563f169
work_keys_str_mv AT huigaiwang studyonthecorrelationbetweenspreadabilityandwettingdrivingforceofnignssreinforcedsnagcurecompositesolder
AT kekezhang studyonthecorrelationbetweenspreadabilityandwettingdrivingforceofnignssreinforcedsnagcurecompositesolder
AT yongjinwu studyonthecorrelationbetweenspreadabilityandwettingdrivingforceofnignssreinforcedsnagcurecompositesolder
AT bingyingwang studyonthecorrelationbetweenspreadabilityandwettingdrivingforceofnignssreinforcedsnagcurecompositesolder
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