Cita APA (7a ed.)

Ni, J., Zhu, X., Yuan, Y., Wang, Z., Li, Y., Ma, L., . . . Li, L. (2020). Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage. Nature Portfolio.

Cita Chicago Style (17a ed.)

Ni, Jiangfeng, et al. Rooting Binder-free Tin Nanoarrays into Copper Substrate via Tin-copper Alloying for Robust Energy Storage. Nature Portfolio, 2020.

Cita MLA (8a ed.)

Ni, Jiangfeng, et al. Rooting Binder-free Tin Nanoarrays into Copper Substrate via Tin-copper Alloying for Robust Energy Storage. Nature Portfolio, 2020.

Precaución: Estas citas no son 100% exactas.