Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.

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Autores principales: Jiangfeng Ni, Xiaocui Zhu, Yifei Yuan, Zhenzhu Wang, Yingbo Li, Lu Ma, Alvin Dai, Matthew Li, Tianpin Wu, Reza Shahbazian-Yassar, Jun Lu, Liang Li
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2020
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Q
Acceso en línea:https://doaj.org/article/da4d6cad6ce8432baebb71bd15abffae
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spelling oai:doaj.org-article:da4d6cad6ce8432baebb71bd15abffae2021-12-02T16:56:50ZRooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage10.1038/s41467-020-15045-x2041-1723https://doaj.org/article/da4d6cad6ce8432baebb71bd15abffae2020-03-01T00:00:00Zhttps://doi.org/10.1038/s41467-020-15045-xhttps://doaj.org/toc/2041-1723The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.Jiangfeng NiXiaocui ZhuYifei YuanZhenzhu WangYingbo LiLu MaAlvin DaiMatthew LiTianpin WuReza Shahbazian-YassarJun LuLiang LiNature PortfolioarticleScienceQENNature Communications, Vol 11, Iss 1, Pp 1-8 (2020)
institution DOAJ
collection DOAJ
language EN
topic Science
Q
spellingShingle Science
Q
Jiangfeng Ni
Xiaocui Zhu
Yifei Yuan
Zhenzhu Wang
Yingbo Li
Lu Ma
Alvin Dai
Matthew Li
Tianpin Wu
Reza Shahbazian-Yassar
Jun Lu
Liang Li
Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
description The authors here report a binder-free electrode based on tin nanoarrays deposited on copper substrate. It is found that the locally formed electrochemically inactive tin-copper alloys work as a glue that bridges tin and copper to survive harsh cycling conditions in sodium ion batteries.
format article
author Jiangfeng Ni
Xiaocui Zhu
Yifei Yuan
Zhenzhu Wang
Yingbo Li
Lu Ma
Alvin Dai
Matthew Li
Tianpin Wu
Reza Shahbazian-Yassar
Jun Lu
Liang Li
author_facet Jiangfeng Ni
Xiaocui Zhu
Yifei Yuan
Zhenzhu Wang
Yingbo Li
Lu Ma
Alvin Dai
Matthew Li
Tianpin Wu
Reza Shahbazian-Yassar
Jun Lu
Liang Li
author_sort Jiangfeng Ni
title Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
title_short Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
title_full Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
title_fullStr Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
title_full_unstemmed Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
title_sort rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
publisher Nature Portfolio
publishDate 2020
url https://doaj.org/article/da4d6cad6ce8432baebb71bd15abffae
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