Recent Advances in Loop Heat Pipes with Flat Evaporator

The focus of this review is to present the current advances in Loop Heat Pipes (LHP) with flat evaporators, which address the current challenges to the wide implementation of the technology. A recent advance in LHP is the design of flat-shaped evaporators, which is better suited to the geometry of d...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autor principal:	Pawel Szymanski
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	loop heat pipe flat evaporators porous structures capillary pressure nanofluids Science Q Astrophysics QB460-466 Physics QC1-999
Acceso en línea:	https://doaj.org/article/da72b77ca5b04d14bd9a3ff742fae945
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:da72b77ca5b04d14bd9a3ff742fae945
record_format	dspace
spelling	oai:doaj.org-article:da72b77ca5b04d14bd9a3ff742fae9452021-11-25T17:29:06ZRecent Advances in Loop Heat Pipes with Flat Evaporator10.3390/e231113741099-4300https://doaj.org/article/da72b77ca5b04d14bd9a3ff742fae9452021-10-01T00:00:00Zhttps://www.mdpi.com/1099-4300/23/11/1374https://doaj.org/toc/1099-4300The focus of this review is to present the current advances in Loop Heat Pipes (LHP) with flat evaporators, which address the current challenges to the wide implementation of the technology. A recent advance in LHP is the design of flat-shaped evaporators, which is better suited to the geometry of discretely mounted electronics components (microprocessors) and therefore negate the need for an additional transfer surface (saddle) between component and evaporator. However, various challenges exist in the implementation of flat-evaporator, including (1) deformation of the evaporator due to high internal pressure and uneven stress distribution in the non-circular casing; (2) heat leak from evaporator heating zone and sidewall into the compensation chamber; (3) poor performance at start-up; (4) reverse flow through the wick; or (5) difficulties in sealing, and hence frequent leakage. This paper presents and reviews state-of-the-art LHP technologies; this includes an (a) review of novel manufacturing methods; (b) LHP evaporator designs; (c) working fluids; and (d) construction materials. The work presents solutions that are used to develop or improve the LHP construction, overall thermal performance, heat transfer distance, start-up time (especially at low heat loads), manufacturing cost, weight, possibilities of miniaturization and how they affect the solution on the above-presented problems and challenges in flat shape LHP development to take advantage in the passive cooling systems for electronic devices in multiple applications.Pawel SzymanskiMDPI AGarticleloop heat pipeflat evaporatorsporous structurescapillary pressurenanofluidsScienceQAstrophysicsQB460-466PhysicsQC1-999ENEntropy, Vol 23, Iss 1374, p 1374 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	loop heat pipe flat evaporators porous structures capillary pressure nanofluids Science Q Astrophysics QB460-466 Physics QC1-999
spellingShingle	loop heat pipe flat evaporators porous structures capillary pressure nanofluids Science Q Astrophysics QB460-466 Physics QC1-999 Pawel Szymanski Recent Advances in Loop Heat Pipes with Flat Evaporator
description	The focus of this review is to present the current advances in Loop Heat Pipes (LHP) with flat evaporators, which address the current challenges to the wide implementation of the technology. A recent advance in LHP is the design of flat-shaped evaporators, which is better suited to the geometry of discretely mounted electronics components (microprocessors) and therefore negate the need for an additional transfer surface (saddle) between component and evaporator. However, various challenges exist in the implementation of flat-evaporator, including (1) deformation of the evaporator due to high internal pressure and uneven stress distribution in the non-circular casing; (2) heat leak from evaporator heating zone and sidewall into the compensation chamber; (3) poor performance at start-up; (4) reverse flow through the wick; or (5) difficulties in sealing, and hence frequent leakage. This paper presents and reviews state-of-the-art LHP technologies; this includes an (a) review of novel manufacturing methods; (b) LHP evaporator designs; (c) working fluids; and (d) construction materials. The work presents solutions that are used to develop or improve the LHP construction, overall thermal performance, heat transfer distance, start-up time (especially at low heat loads), manufacturing cost, weight, possibilities of miniaturization and how they affect the solution on the above-presented problems and challenges in flat shape LHP development to take advantage in the passive cooling systems for electronic devices in multiple applications.
format	article
author	Pawel Szymanski
author_facet	Pawel Szymanski
author_sort	Pawel Szymanski
title	Recent Advances in Loop Heat Pipes with Flat Evaporator
title_short	Recent Advances in Loop Heat Pipes with Flat Evaporator
title_full	Recent Advances in Loop Heat Pipes with Flat Evaporator
title_fullStr	Recent Advances in Loop Heat Pipes with Flat Evaporator
title_full_unstemmed	Recent Advances in Loop Heat Pipes with Flat Evaporator
title_sort	recent advances in loop heat pipes with flat evaporator
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/da72b77ca5b04d14bd9a3ff742fae945
work_keys_str_mv	AT pawelszymanski recentadvancesinloopheatpipeswithflatevaporator
_version_	1718412315861188608

Recent Advances in Loop Heat Pipes with Flat Evaporator

Ejemplares similares