Cheng, S., Tian, Z., Wu, X., & Niu, J. (2021). Bottom-Up Model of Random Daily Electrical Load Curve for Office Building. MDPI AG.
Style de citation Chicago (17e éd.)Cheng, Sihan, Zhe Tian, Xia Wu, et Jide Niu. Bottom-Up Model of Random Daily Electrical Load Curve for Office Building. MDPI AG, 2021.
Style de citation MLA (8e éd.)Cheng, Sihan, et al. Bottom-Up Model of Random Daily Electrical Load Curve for Office Building. MDPI AG, 2021.
Attention : ces citations peuvent ne pas être correctes à 100%.