Cita APA (7a ed.)

Cheng, S., Tian, Z., Wu, X., & Niu, J. (2021). Bottom-Up Model of Random Daily Electrical Load Curve for Office Building. MDPI AG.

Cita Chicago Style (17a ed.)

Cheng, Sihan, Zhe Tian, Xia Wu, y Jide Niu. Bottom-Up Model of Random Daily Electrical Load Curve for Office Building. MDPI AG, 2021.

Cita MLA (8a ed.)

Cheng, Sihan, et al. Bottom-Up Model of Random Daily Electrical Load Curve for Office Building. MDPI AG, 2021.

Precaución: Estas citas no son 100% exactas.