Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)
Miniaturization of electronics devices is often limited by the concomitant high heat fluxes (cooling load) and maldistribution of temperature profiles (hot spots). Thermal energy storage (TES) platforms providing supplemental cooling can be a cost-effective solution, that often leverages phase chang...
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| Autores principales: | , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/de7dd1e229db4f9d8cf2b222d93981b6 |
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