Dicing of composite substrate for thin film AlGaInP power LEDs by wet etching
Abstract In this paper, thin film AlGaInP LED chips with a 50 μm thick composite metal substrate (Copper-Invar-Copper; CIC) were obtained by the wet etching process. The pattern of the substrate was done by the backside of the AlGaInP LED/CIC. There was no delamination or cracking phenomenon of the...
Enregistré dans:
| Auteurs principaux: | , , , , |
|---|---|
| Format: | article |
| Langue: | EN |
| Publié: |
Nature Portfolio
2021
|
| Sujets: | |
| Accès en ligne: | https://doaj.org/article/deff4a8eb7c44ac892736feab6798042 |
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|