Ultra-thin chips for high-performance flexible electronics

Abstract Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated cir...

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Autores principales:	Shoubhik Gupta, William Taube Navaraj, Leandro Lorenzelli, Ravinder Dahiya
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/e3707c1d6f564f22af52f13d6be12803
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spelling	oai:doaj.org-article:e3707c1d6f564f22af52f13d6be128032021-12-02T14:24:12ZUltra-thin chips for high-performance flexible electronics10.1038/s41528-018-0021-52397-4621https://doaj.org/article/e3707c1d6f564f22af52f13d6be128032018-03-01T00:00:00Zhttps://doi.org/10.1038/s41528-018-0021-5https://doaj.org/toc/2397-4621Abstract Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.Shoubhik GuptaWilliam Taube NavarajLeandro LorenzelliRavinder DahiyaNature PortfolioarticleElectronicsTK7800-8360Materials of engineering and construction. Mechanics of materialsTA401-492ENnpj Flexible Electronics, Vol 2, Iss 1, Pp 1-17 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492 Shoubhik Gupta William Taube Navaraj Leandro Lorenzelli Ravinder Dahiya Ultra-thin chips for high-performance flexible electronics
description	Abstract Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
format	article
author	Shoubhik Gupta William Taube Navaraj Leandro Lorenzelli Ravinder Dahiya
author_facet	Shoubhik Gupta William Taube Navaraj Leandro Lorenzelli Ravinder Dahiya
author_sort	Shoubhik Gupta
title	Ultra-thin chips for high-performance flexible electronics
title_short	Ultra-thin chips for high-performance flexible electronics
title_full	Ultra-thin chips for high-performance flexible electronics
title_fullStr	Ultra-thin chips for high-performance flexible electronics
title_full_unstemmed	Ultra-thin chips for high-performance flexible electronics
title_sort	ultra-thin chips for high-performance flexible electronics
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/e3707c1d6f564f22af52f13d6be12803
work_keys_str_mv	AT shoubhikgupta ultrathinchipsforhighperformanceflexibleelectronics AT williamtaubenavaraj ultrathinchipsforhighperformanceflexibleelectronics AT leandrolorenzelli ultrathinchipsforhighperformanceflexibleelectronics AT ravinderdahiya ultrathinchipsforhighperformanceflexibleelectronics
_version_	1718391458402140160

Ultra-thin chips for high-performance flexible electronics

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