Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)

This study was conducted to investigate the effect of Cu nano particles addition on the density profile and mechanical properties of medium density fiberboard. One layer fiberboard (MDF) with the density of 0.58g/cm3and thickness of 17 mm were produced using Cu nano particles in three levels (5, 10...

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Autores principales:	Aliakbar Aenayati, Halimeh Pangh, Mahammad Layeghi, Kazem Doosthosseini
Formato:	article
Lenguaje:	FA
Publicado:	Regional Information Center for Science and Technology (RICeST) 2014
Materias:	MEDIUM DENSITY FIBERBOARD Cu nano-particles. Density profile MECHANICAL PROPERTIES Forestry SD1-669.5
Acceso en línea:	https://doaj.org/article/e479394635a8483aad10b45552243ed1
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id	oai:doaj.org-article:e479394635a8483aad10b45552243ed1
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spelling	oai:doaj.org-article:e479394635a8483aad10b45552243ed12021-12-02T07:20:16ZEvaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)1735-09132383-112X10.22092/ijwpr.2014.6133https://doaj.org/article/e479394635a8483aad10b45552243ed12014-09-01T00:00:00Zhttp://ijwpr.areeo.ac.ir/article_6133_24622f6ef629a7be9f898c732b78b006.pdfhttps://doaj.org/toc/1735-0913https://doaj.org/toc/2383-112XThis study was conducted to investigate the effect of Cu nano particles addition on the density profile and mechanical properties of medium density fiberboard. One layer fiberboard (MDF) with the density of 0.58g/cm3and thickness of 17 mm were produced using Cu nano particles in three levels (5, 10 and 15wt%based on solid content of resin) and urea formaldehyde resin content in two levels (8 and 10wt%based on oven dry weight of fibers) as variable factors. The control panels were produced using 10% resin (based on oven dry weight of fibers) without Cu nano particles using the identical manufacturing parameters as other panels. Mechanical strength including internal bonding (lB), bending strength, modulus of elasticity and density profile using slicing method were determined. The results indicated that increasing the content of Cu nano-particles had no significant effect on the internal bonding as well as bending strength and modulus of elasticity of panels. Increasing the resin content from 8 to 10 percent improved modulus of elasticity (43.7%), bending strength (18.9%) and internal bonding (23%) of panels. In addition, the increasing Cu nano particles up to 5% caused relatively higher IB for panels produced using 8%resin compared to the control panels(containing10% resin) as well as the density profile was more uniform with the lowest differences between maximum and minimum density in the density profile.Aliakbar AenayatiHalimeh PanghMahammad LayeghiKazem DoosthosseiniRegional Information Center for Science and Technology (RICeST)articleMEDIUM DENSITY FIBERBOARDCu nano-particles. Density profileMECHANICAL PROPERTIESForestrySD1-669.5FAتحقیقات علوم چوب و کاغذ ایران, Vol 29, Iss 3, Pp 368-375 (2014)
institution	DOAJ
collection	DOAJ
language	FA
topic	MEDIUM DENSITY FIBERBOARD Cu nano-particles. Density profile MECHANICAL PROPERTIES Forestry SD1-669.5
spellingShingle	MEDIUM DENSITY FIBERBOARD Cu nano-particles. Density profile MECHANICAL PROPERTIES Forestry SD1-669.5 Aliakbar Aenayati Halimeh Pangh Mahammad Layeghi Kazem Doosthosseini Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)
description	This study was conducted to investigate the effect of Cu nano particles addition on the density profile and mechanical properties of medium density fiberboard. One layer fiberboard (MDF) with the density of 0.58g/cm3and thickness of 17 mm were produced using Cu nano particles in three levels (5, 10 and 15wt%based on solid content of resin) and urea formaldehyde resin content in two levels (8 and 10wt%based on oven dry weight of fibers) as variable factors. The control panels were produced using 10% resin (based on oven dry weight of fibers) without Cu nano particles using the identical manufacturing parameters as other panels. Mechanical strength including internal bonding (lB), bending strength, modulus of elasticity and density profile using slicing method were determined. The results indicated that increasing the content of Cu nano-particles had no significant effect on the internal bonding as well as bending strength and modulus of elasticity of panels. Increasing the resin content from 8 to 10 percent improved modulus of elasticity (43.7%), bending strength (18.9%) and internal bonding (23%) of panels. In addition, the increasing Cu nano particles up to 5% caused relatively higher IB for panels produced using 8%resin compared to the control panels(containing10% resin) as well as the density profile was more uniform with the lowest differences between maximum and minimum density in the density profile.
format	article
author	Aliakbar Aenayati Halimeh Pangh Mahammad Layeghi Kazem Doosthosseini
author_facet	Aliakbar Aenayati Halimeh Pangh Mahammad Layeghi Kazem Doosthosseini
author_sort	Aliakbar Aenayati
title	Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)
title_short	Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)
title_full	Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)
title_fullStr	Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)
title_full_unstemmed	Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)
title_sort	evaluation of cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (mdf)
publisher	Regional Information Center for Science and Technology (RICeST)
publishDate	2014
url	https://doaj.org/article/e479394635a8483aad10b45552243ed1
work_keys_str_mv	AT aliakbaraenayati evaluationofcunanoparticlesadditionontheverticaldensityprofileandmechanicalpropertiesofmediumdensityfiberboardmdf AT halimehpangh evaluationofcunanoparticlesadditionontheverticaldensityprofileandmechanicalpropertiesofmediumdensityfiberboardmdf AT mahammadlayeghi evaluationofcunanoparticlesadditionontheverticaldensityprofileandmechanicalpropertiesofmediumdensityfiberboardmdf AT kazemdoosthosseini evaluationofcunanoparticlesadditionontheverticaldensityprofileandmechanicalpropertiesofmediumdensityfiberboardmdf
_version_	1718399489073479680

Evaluation of Cu nano particles addition on the vertical density profile and mechanical properties of medium density fiberboard (MDF)

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