Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets

Abstract Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synerg...

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Autores principales:	Zhengdong Wang, Guodong Meng, Liangliang Wang, Liliang Tian, Siyu Chen, Guanglei Wu, Bo Kong, Yonghong Cheng
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/e5340b60ab5946f0a4ca19f03187903e
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spelling	oai:doaj.org-article:e5340b60ab5946f0a4ca19f03187903e2021-12-02T14:16:07ZSimultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets10.1038/s41598-021-81925-x2045-2322https://doaj.org/article/e5340b60ab5946f0a4ca19f03187903e2021-01-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-81925-xhttps://doaj.org/toc/2045-2322Abstract Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10−1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.Zhengdong WangGuodong MengLiangliang WangLiliang TianSiyu ChenGuanglei WuBo KongYonghong ChengNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-11 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Zhengdong Wang Guodong Meng Liangliang Wang Liliang Tian Siyu Chen Guanglei Wu Bo Kong Yonghong Cheng Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
description	Abstract Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10−1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.
format	article
author	Zhengdong Wang Guodong Meng Liangliang Wang Liliang Tian Siyu Chen Guanglei Wu Bo Kong Yonghong Cheng
author_facet	Zhengdong Wang Guodong Meng Liangliang Wang Liliang Tian Siyu Chen Guanglei Wu Bo Kong Yonghong Cheng
author_sort	Zhengdong Wang
title	Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
title_short	Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
title_full	Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
title_fullStr	Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
title_full_unstemmed	Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
title_sort	simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/e5340b60ab5946f0a4ca19f03187903e
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Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets

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