Large-area plastic nanogap electronics enabled by adhesion lithography
Adhesion lithography enables coplanar nanogap electrode fabrication and allows for the realisation of nanoscale electronics manufacturing A collaborative team led by Thomas Anthopoulos from King Abdullah University of Science and Technology demonstrated a novel method for patterning coplanar electro...
Guardado en:
Autores principales: | , , , , , , , , , , |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
Nature Portfolio
2018
|
Materias: | |
Acceso en línea: | https://doaj.org/article/e5ced24ce9a24d6cabd755be00167a49 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
Sumario: | Adhesion lithography enables coplanar nanogap electrode fabrication and allows for the realisation of nanoscale electronics manufacturing A collaborative team led by Thomas Anthopoulos from King Abdullah University of Science and Technology demonstrated a novel method for patterning coplanar electrodes with inter-electrode distances of less than 15 nm and arbitrarily large aspect ratios. This facile manufacturing method, called adhesion lithography, was used to fabricate a series of functional nanoscale electronic devices on various substrates. These flexible electronic devices, which are technologically relevant, included self-aligned-gate transistors, radio frequency diodes and rectifying circuits, multi-colour organic light-emitting diodes and multilevel non-volatile memory devices. Given its versatility in the fabrication of functional electronic devices and its solution-processing compatibility with a range of semiconductors and substrate materials, adhesion lithography is an attractive processing method for the high-throughput manufacture of large-scale flexible electronics at the nanoscale. |
---|