Particleboards from Recycled Thermally Modified Wood
In recent years, the production and consumption of thermally modified wood (TMW) has been increasing. Offcuts and other waste generated during TMWs processing into products, as well as already disposed products based on TMWs can be an input recycled raw material for production of particleboards (PBs...
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| Format: | article |
| Langue: | EN |
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MDPI AG
2021
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| Accès en ligne: | https://doaj.org/article/e789a4d1d9b5482b86f9c1f1344d08ec |
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| Résumé: | In recent years, the production and consumption of thermally modified wood (TMW) has been increasing. Offcuts and other waste generated during TMWs processing into products, as well as already disposed products based on TMWs can be an input recycled raw material for production of particleboards (PBs). In a laboratory, 16 mm thick 3-layer PBs bonded with urea-formaldehyde (UF) resin were produced at 5.8 MPa, 240 °C and 8 s pressing factor. In PBs, the particles from fresh spruce wood and mixed particles from offcuts of pine, beech, and ash TMWs were combined in weight ratios of 100:0, 80:20, 50:50 and 0:100. Thickness swelling (TS) and water absorption (WA) of PBs decreased with increased portion of TMW particles, i.e., TS after 24 h maximally about 72.3% and WA after 24 h maximally about 64%. However, mechanical properties of PBs worsened proportionally with a higher content of recycled TMW—apparently, the modulus of rupture (MOR) up to 55.5% and internal bond (IB) up to 46.2%, while negative effect of TMW particles on the modulus of elasticity (MOE) was milder. Decay resistance of PBs to the brown-rot fungus <i>Serpula lacrymans</i> (Schumacher ex Fries) S.F. Gray increased if they contained TMW particles, maximally about 45%, while the mould resistance of PBs containing TMW particles improved only in the first days of test. In summary, the recycled TMW particles can improve the decay and water resistance of PBs exposed to higher humidity environment. However, worsening of their mechanical properties could appear, as well. |
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