Cita APA (7a ed.)

Kim, B., Han, S., Park, S., Kim, S., Jung, M., Park, C., . . . Han, Y. (2021). Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG.

Cita Chicago Style (17a ed.)

Kim, Boram, Seongsoo Han, Seungsoo Park, Seongmin Kim, Minuk Jung, Chul-Hyun Park, Ho-Seok Jeon, Dae-Weon Kim, y Yosep Han. Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG, 2021.

Cita MLA (8a ed.)

Kim, Boram, et al. Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG, 2021.