APA (7th ed.) Citation

Kim, B., Han, S., Park, S., Kim, S., Jung, M., Park, C., . . . Han, Y. (2021). Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG.

Chicago Style (17th ed.) Citation

Kim, Boram, Seongsoo Han, Seungsoo Park, Seongmin Kim, Minuk Jung, Chul-Hyun Park, Ho-Seok Jeon, Dae-Weon Kim, and Yosep Han. Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG, 2021.

MLA (8th ed.) Citation

Kim, Boram, et al. Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG, 2021.