Style de citation APA (7e éd.)

Kim, B., Han, S., Park, S., Kim, S., Jung, M., Park, C., . . . Han, Y. (2021). Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG.

Style de citation Chicago (17e éd.)

Kim, Boram, Seongsoo Han, Seungsoo Park, Seongmin Kim, Minuk Jung, Chul-Hyun Park, Ho-Seok Jeon, Dae-Weon Kim, et Yosep Han. Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG, 2021.

Style de citation MLA (8e éd.)

Kim, Boram, et al. Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas. MDPI AG, 2021.