Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas

Printed circuit boards (PCBs) are difficult to recycle because of the layered structure of non-metal (i.e., epoxy resin, glass fiber) and copper. In this work, we conducted a systematic investigation to effectively recover copper from PCB. A thermal treatment was employed for improving the crushing...

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Autores principales:	Boram Kim, Seongsoo Han, Seungsoo Park, Seongmin Kim, Minuk Jung, Chul-Hyun Park, Ho-Seok Jeon, Dae-Weon Kim, Yosep Han
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	printed circuit boards heat treatment strength liberation Cu recovery physical separation Mineralogy QE351-399.2
Acceso en línea:	https://doaj.org/article/f61f8857c4af4f4296a47176cda9d79a
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spelling	oai:doaj.org-article:f61f8857c4af4f4296a47176cda9d79a2021-11-25T18:26:20ZOptimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas10.3390/min111112132075-163Xhttps://doaj.org/article/f61f8857c4af4f4296a47176cda9d79a2021-10-01T00:00:00Zhttps://www.mdpi.com/2075-163X/11/11/1213https://doaj.org/toc/2075-163XPrinted circuit boards (PCBs) are difficult to recycle because of the layered structure of non-metal (i.e., epoxy resin, glass fiber) and copper. In this work, we conducted a systematic investigation to effectively recover copper from PCB. A thermal treatment was employed for improving the crushing performance of PCB and conducted by varying the temperature and the gas. Then, the mechanical strength, degree of liberation (DL), and copper separation efficiency of the heat-treated and untreated PCBs were investigated. After heat treatment under a 300 °C air atmosphere, the mechanical strength of PCB decreased from 386.36 to 24.26 MPa, and copper liberation improved from 9.3% to 100% in the size range of a coarser size fraction (>1400 μm). Accordingly, when electrostatic separations were performed under these conditions, a high-Cu-grade concentrate and high recovery could be obtained. The results show that the change in the physical properties of the PCBs leads to an improvement in the DL following thermal decomposition at 300 °C in air. Our study elucidates the physical properties of PCBs and the DL under various heat treatment conditions. Furthermore, it shows that the heat treatment condition of 300 °C in air is ideal for recovering copper from the PCB.Boram KimSeongsoo HanSeungsoo ParkSeongmin KimMinuk JungChul-Hyun ParkHo-Seok JeonDae-Weon KimYosep HanMDPI AGarticleprinted circuit boardsheat treatmentstrengthliberationCu recoveryphysical separationMineralogyQE351-399.2ENMinerals, Vol 11, Iss 1213, p 1213 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	printed circuit boards heat treatment strength liberation Cu recovery physical separation Mineralogy QE351-399.2
spellingShingle	printed circuit boards heat treatment strength liberation Cu recovery physical separation Mineralogy QE351-399.2 Boram Kim Seongsoo Han Seungsoo Park Seongmin Kim Minuk Jung Chul-Hyun Park Ho-Seok Jeon Dae-Weon Kim Yosep Han Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
description	Printed circuit boards (PCBs) are difficult to recycle because of the layered structure of non-metal (i.e., epoxy resin, glass fiber) and copper. In this work, we conducted a systematic investigation to effectively recover copper from PCB. A thermal treatment was employed for improving the crushing performance of PCB and conducted by varying the temperature and the gas. Then, the mechanical strength, degree of liberation (DL), and copper separation efficiency of the heat-treated and untreated PCBs were investigated. After heat treatment under a 300 °C air atmosphere, the mechanical strength of PCB decreased from 386.36 to 24.26 MPa, and copper liberation improved from 9.3% to 100% in the size range of a coarser size fraction (>1400 μm). Accordingly, when electrostatic separations were performed under these conditions, a high-Cu-grade concentrate and high recovery could be obtained. The results show that the change in the physical properties of the PCBs leads to an improvement in the DL following thermal decomposition at 300 °C in air. Our study elucidates the physical properties of PCBs and the DL under various heat treatment conditions. Furthermore, it shows that the heat treatment condition of 300 °C in air is ideal for recovering copper from the PCB.
format	article
author	Boram Kim Seongsoo Han Seungsoo Park Seongmin Kim Minuk Jung Chul-Hyun Park Ho-Seok Jeon Dae-Weon Kim Yosep Han
author_facet	Boram Kim Seongsoo Han Seungsoo Park Seongmin Kim Minuk Jung Chul-Hyun Park Ho-Seok Jeon Dae-Weon Kim Yosep Han
author_sort	Boram Kim
title	Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
title_short	Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
title_full	Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
title_fullStr	Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
title_full_unstemmed	Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas
title_sort	optimal thermal treatment for effective copper recovery in waste printed circuit boards by physical separation: influence of temperature and gas
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/f61f8857c4af4f4296a47176cda9d79a
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_version_	1718411172260085760

Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas

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