Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

Abstract This study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures. Silica nanoparticles (NPs) were deposited onto a silver powder surface to inhibit silver leaching, which can lead to solderi...

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Autores principales:	Hsing-I Hsiang, Chih-Cheng Chen, Han-Yang Su
Formato:	article
Lenguaje:	EN
Publicado:	Springer 2021
Materias:	Lead-free solder Silver paste Ag3Sn Intermetallic compound Silica nanoparticle Science Q Technology T
Acceso en línea:	https://doaj.org/article/f7127188cab6485d8ee441349817b819
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spelling	oai:doaj.org-article:f7127188cab6485d8ee441349817b8192021-11-21T12:12:28ZEffect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor10.1007/s42452-021-04861-52523-39632523-3971https://doaj.org/article/f7127188cab6485d8ee441349817b8192021-11-01T00:00:00Zhttps://doi.org/10.1007/s42452-021-04861-5https://doaj.org/toc/2523-3963https://doaj.org/toc/2523-3971Abstract This study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures. Silica nanoparticles (NPs) were deposited onto a silver powder surface to inhibit silver leaching, which can lead to soldering joint failure during high-temperature soldering. The NPs were deposited through hydrolysis and a condensation reaction of tetraethyl orthosilicate (TEOS) based on the Stöber method. Fourier transform infrared spectroscopy and scanning electron microscopy were used to observe the microstructures of silver powders after the deposition of silica NPs with various TEOS concentrations and various deposition times. As the deposition time increased, the amount of silica NPs on the surface of the silver powder increased. The transmission electron microscopy results show that silica NPs were located at the IMC grain boundaries, which can hinder the dissolution of IMCs by lead-free solder melt along grain boundaries during soldering, retarding silver leaching. The growth kinetics and mechanism of IMCs during soldering were investigated. The results show that the growth of IMCs is mainly dominated by bulk diffusion. The activation energy for IMC growth increased and the growth rate decreased with increasing silica NP addition and deposition time.Hsing-I HsiangChih-Cheng ChenHan-Yang SuSpringerarticleLead-free solderSilver pasteAg3SnIntermetallic compoundSilica nanoparticleScienceQTechnologyTENSN Applied Sciences, Vol 3, Iss 12, Pp 1-12 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Lead-free solder Silver paste Ag3Sn Intermetallic compound Silica nanoparticle Science Q Technology T
spellingShingle	Lead-free solder Silver paste Ag3Sn Intermetallic compound Silica nanoparticle Science Q Technology T Hsing-I Hsiang Chih-Cheng Chen Han-Yang Su Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
description	Abstract This study investigated the effects of silver powder modification on intermetallic compound (IMC) formation and silver leaching during soldering at high temperatures. Silica nanoparticles (NPs) were deposited onto a silver powder surface to inhibit silver leaching, which can lead to soldering joint failure during high-temperature soldering. The NPs were deposited through hydrolysis and a condensation reaction of tetraethyl orthosilicate (TEOS) based on the Stöber method. Fourier transform infrared spectroscopy and scanning electron microscopy were used to observe the microstructures of silver powders after the deposition of silica NPs with various TEOS concentrations and various deposition times. As the deposition time increased, the amount of silica NPs on the surface of the silver powder increased. The transmission electron microscopy results show that silica NPs were located at the IMC grain boundaries, which can hinder the dissolution of IMCs by lead-free solder melt along grain boundaries during soldering, retarding silver leaching. The growth kinetics and mechanism of IMCs during soldering were investigated. The results show that the growth of IMCs is mainly dominated by bulk diffusion. The activation energy for IMC growth increased and the growth rate decreased with increasing silica NP addition and deposition time.
format	article
author	Hsing-I Hsiang Chih-Cheng Chen Han-Yang Su
author_facet	Hsing-I Hsiang Chih-Cheng Chen Han-Yang Su
author_sort	Hsing-I Hsiang
title	Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
title_short	Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
title_full	Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
title_fullStr	Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
title_full_unstemmed	Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor
title_sort	effect of sio2 nanoparticle addition on growth of interfacial ag3sn intermetallic compound layers between lead-free solder and silver conductor
publisher	Springer
publishDate	2021
url	https://doaj.org/article/f7127188cab6485d8ee441349817b819
work_keys_str_mv	AT hsingihsiang effectofsio2nanoparticleadditionongrowthofinterfacialag3snintermetalliccompoundlayersbetweenleadfreesolderandsilverconductor AT chihchengchen effectofsio2nanoparticleadditionongrowthofinterfacialag3snintermetalliccompoundlayersbetweenleadfreesolderandsilverconductor AT hanyangsu effectofsio2nanoparticleadditionongrowthofinterfacialag3snintermetalliccompoundlayersbetweenleadfreesolderandsilverconductor
_version_	1718419162530840576

Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

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