Laser machining of transparent brittle materials: from machining strategies to applications

Transparent brittle materials such as glass and sapphire are widely concerned and applied in consumer electronics, optoelectronic devices, etc. due to their excellent physical and chemical stability and good transparency. Growing research attention has been paid to developing novel methods for high-...

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Autores principales:	Xie Xiaozhu, Zhou Caixia, Wei Xin, Hu Wei, Ren Qinglei
Formato:	article
Lenguaje:	EN
Publicado:	Institue of Optics and Electronics, Chinese Academy of Sciences 2019
Materias:	transparent brittle materials glass sapphire laser machining Optics. Light QC350-467
Acceso en línea:	https://doaj.org/article/f798e9d424be42d18f48db5f3e3292d5
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id	oai:doaj.org-article:f798e9d424be42d18f48db5f3e3292d5
record_format	dspace
spelling	oai:doaj.org-article:f798e9d424be42d18f48db5f3e3292d52021-11-11T09:54:39ZLaser machining of transparent brittle materials: from machining strategies to applications2096-457910.29026/oea.2019.180017https://doaj.org/article/f798e9d424be42d18f48db5f3e3292d52019-01-01T00:00:00Zhttp://www.oejournal.org/article/doi/10.29026/oea.2019.180017https://doaj.org/toc/2096-4579Transparent brittle materials such as glass and sapphire are widely concerned and applied in consumer electronics, optoelectronic devices, etc. due to their excellent physical and chemical stability and good transparency. Growing research attention has been paid to developing novel methods for high-precision and high-quality machining of transparent brittle materials in the past few decades. Among the various techniques, laser machining has been proved to be an effective and flexible way to process all kinds of transparent brittle materials. In this review, a series of laser machining methods, e.g. laser full cutting, laser scribing, laser stealth dicing, laser filament, laser induced backside dry etching (LIBDE), and laser induced backside wet etching (LIBWE) are summarized. Additionally, applications of these techniques in micromachining, drilling and cutting, and patterning are introduced in detail. Current challenges and future prospects in this field are also discussed.Xie XiaozhuZhou CaixiaWei XinHu WeiRen QingleiInstitue of Optics and Electronics, Chinese Academy of Sciencesarticletransparent brittle materialsglasssapphirelaser machiningOptics. LightQC350-467ENOpto-Electronic Advances, Vol 2, Iss 1, Pp 180017-1-180017-13 (2019)
institution	DOAJ
collection	DOAJ
language	EN
topic	transparent brittle materials glass sapphire laser machining Optics. Light QC350-467
spellingShingle	transparent brittle materials glass sapphire laser machining Optics. Light QC350-467 Xie Xiaozhu Zhou Caixia Wei Xin Hu Wei Ren Qinglei Laser machining of transparent brittle materials: from machining strategies to applications
description	Transparent brittle materials such as glass and sapphire are widely concerned and applied in consumer electronics, optoelectronic devices, etc. due to their excellent physical and chemical stability and good transparency. Growing research attention has been paid to developing novel methods for high-precision and high-quality machining of transparent brittle materials in the past few decades. Among the various techniques, laser machining has been proved to be an effective and flexible way to process all kinds of transparent brittle materials. In this review, a series of laser machining methods, e.g. laser full cutting, laser scribing, laser stealth dicing, laser filament, laser induced backside dry etching (LIBDE), and laser induced backside wet etching (LIBWE) are summarized. Additionally, applications of these techniques in micromachining, drilling and cutting, and patterning are introduced in detail. Current challenges and future prospects in this field are also discussed.
format	article
author	Xie Xiaozhu Zhou Caixia Wei Xin Hu Wei Ren Qinglei
author_facet	Xie Xiaozhu Zhou Caixia Wei Xin Hu Wei Ren Qinglei
author_sort	Xie Xiaozhu
title	Laser machining of transparent brittle materials: from machining strategies to applications
title_short	Laser machining of transparent brittle materials: from machining strategies to applications
title_full	Laser machining of transparent brittle materials: from machining strategies to applications
title_fullStr	Laser machining of transparent brittle materials: from machining strategies to applications
title_full_unstemmed	Laser machining of transparent brittle materials: from machining strategies to applications
title_sort	laser machining of transparent brittle materials: from machining strategies to applications
publisher	Institue of Optics and Electronics, Chinese Academy of Sciences
publishDate	2019
url	https://doaj.org/article/f798e9d424be42d18f48db5f3e3292d5
work_keys_str_mv	AT xiexiaozhu lasermachiningoftransparentbrittlematerialsfrommachiningstrategiestoapplications AT zhoucaixia lasermachiningoftransparentbrittlematerialsfrommachiningstrategiestoapplications AT weixin lasermachiningoftransparentbrittlematerialsfrommachiningstrategiestoapplications AT huwei lasermachiningoftransparentbrittlematerialsfrommachiningstrategiestoapplications AT renqinglei lasermachiningoftransparentbrittlematerialsfrommachiningstrategiestoapplications
_version_	1718439275960205312

Laser machining of transparent brittle materials: from machining strategies to applications

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