Fabrication of solderable intense pulsed light sintered hybrid copper for flexible conductive electrodes
Abstract Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, I...
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Auteurs principaux: | Yong-Rae Jang, Robin Jeong, Hak-Sung Kim, Simon S. Park |
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Format: | article |
Langue: | EN |
Publié: |
Nature Portfolio
2021
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Accès en ligne: | https://doaj.org/article/f9f14a64d4e14069869aff6231e29e4e |
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