Reliability of MEMS in Shock Environments: 2000–2020

The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the r...

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Autores principales: Tianfang Peng, Zheng You
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Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/fd745d0249e94680b59f31facc37e8f1
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spelling oai:doaj.org-article:fd745d0249e94680b59f31facc37e8f12021-11-25T18:22:42ZReliability of MEMS in Shock Environments: 2000–202010.3390/mi121112752072-666Xhttps://doaj.org/article/fd745d0249e94680b59f31facc37e8f12021-10-01T00:00:00Zhttps://www.mdpi.com/2072-666X/12/11/1275https://doaj.org/toc/2072-666XThe reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.Tianfang PengZheng YouMDPI AGarticleMEMSshockreliabilitymicrostructure mechanicsMechanical engineering and machineryTJ1-1570ENMicromachines, Vol 12, Iss 1275, p 1275 (2021)
institution DOAJ
collection DOAJ
language EN
topic MEMS
shock
reliability
microstructure mechanics
Mechanical engineering and machinery
TJ1-1570
spellingShingle MEMS
shock
reliability
microstructure mechanics
Mechanical engineering and machinery
TJ1-1570
Tianfang Peng
Zheng You
Reliability of MEMS in Shock Environments: 2000–2020
description The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.
format article
author Tianfang Peng
Zheng You
author_facet Tianfang Peng
Zheng You
author_sort Tianfang Peng
title Reliability of MEMS in Shock Environments: 2000–2020
title_short Reliability of MEMS in Shock Environments: 2000–2020
title_full Reliability of MEMS in Shock Environments: 2000–2020
title_fullStr Reliability of MEMS in Shock Environments: 2000–2020
title_full_unstemmed Reliability of MEMS in Shock Environments: 2000–2020
title_sort reliability of mems in shock environments: 2000–2020
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/fd745d0249e94680b59f31facc37e8f1
work_keys_str_mv AT tianfangpeng reliabilityofmemsinshockenvironments20002020
AT zhengyou reliabilityofmemsinshockenvironments20002020
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