Deposition of nickel films by TVA

Plasma diagnostic techniques are essential for understanding of process parameters. In plasma-assisted deposition, ion energy and deposition rate are key parameters for technological control. In this paper, a systematic study of the correlation of electrical parameters of plasma with ion ener...

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Autores principales:	Surdu-Bob, C., Badulescu, M., Lungu, C., Georgescu, Costinela
Formato:	article
Lenguaje:	EN
Publicado:	D.Ghitu Institute of Electronic Engineering and Nanotechnologies 2008
Materias:	Physics QC1-999 Electronics TK7800-8360
Acceso en línea:	https://doaj.org/article/feccd85af4334590abc332d0e0f2df32
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spelling	oai:doaj.org-article:feccd85af4334590abc332d0e0f2df322021-11-21T12:06:57ZDeposition of nickel films by TVA2537-63651810-648Xhttps://doaj.org/article/feccd85af4334590abc332d0e0f2df322008-04-01T00:00:00Zhttps://mjps.nanotech.md/archive/2008/article/3794https://doaj.org/toc/1810-648Xhttps://doaj.org/toc/2537-6365Plasma diagnostic techniques are essential for understanding of process parameters. In plasma-assisted deposition, ion energy and deposition rate are key parameters for technological control. In this paper, a systematic study of the correlation of electrical parameters of plasma with ion energy distributions and deposition rate is presented. The deposition method used in this study is Thermionic Vacuum Arc (TVA) ignited in nickel vapors. The TVA deposition method briefly consists in obtaining of plasma in vapors of the material to be evaporated. The vapors are obtained by heating the material with thermoelectrons generated by an externally heated filament. An in-house, computer-controlled RFA analyzer was used for determination of ion energy distributions at a point situated about 25 cm from the anode. The retarding field analyzer (RFA) is an electrical probe capable of providing ion energy distributions in plasmas. AFM analysis has shown that nickel films obtained by TVA are very smooth. It was found that the ion energy increases with the power introduced into the system and it decreases with decreasing filament current. The adhesion for the films deposited by TVA was found to be very good. A clear picture of the optimal TVA plasma conditions for the highest adhesion and deposition rate was obtained. Surdu-Bob, C.Badulescu, M.Lungu, C.Georgescu, CostinelaD.Ghitu Institute of Electronic Engineering and NanotechnologiesarticlePhysicsQC1-999ElectronicsTK7800-8360ENMoldavian Journal of the Physical Sciences, Vol 7, Iss 2, Pp 145-151 (2008)
institution	DOAJ
collection	DOAJ
language	EN
topic	Physics QC1-999 Electronics TK7800-8360
spellingShingle	Physics QC1-999 Electronics TK7800-8360 Surdu-Bob, C. Badulescu, M. Lungu, C. Georgescu, Costinela Deposition of nickel films by TVA
description	Plasma diagnostic techniques are essential for understanding of process parameters. In plasma-assisted deposition, ion energy and deposition rate are key parameters for technological control. In this paper, a systematic study of the correlation of electrical parameters of plasma with ion energy distributions and deposition rate is presented. The deposition method used in this study is Thermionic Vacuum Arc (TVA) ignited in nickel vapors. The TVA deposition method briefly consists in obtaining of plasma in vapors of the material to be evaporated. The vapors are obtained by heating the material with thermoelectrons generated by an externally heated filament. An in-house, computer-controlled RFA analyzer was used for determination of ion energy distributions at a point situated about 25 cm from the anode. The retarding field analyzer (RFA) is an electrical probe capable of providing ion energy distributions in plasmas. AFM analysis has shown that nickel films obtained by TVA are very smooth. It was found that the ion energy increases with the power introduced into the system and it decreases with decreasing filament current. The adhesion for the films deposited by TVA was found to be very good. A clear picture of the optimal TVA plasma conditions for the highest adhesion and deposition rate was obtained.
format	article
author	Surdu-Bob, C. Badulescu, M. Lungu, C. Georgescu, Costinela
author_facet	Surdu-Bob, C. Badulescu, M. Lungu, C. Georgescu, Costinela
author_sort	Surdu-Bob, C.
title	Deposition of nickel films by TVA
title_short	Deposition of nickel films by TVA
title_full	Deposition of nickel films by TVA
title_fullStr	Deposition of nickel films by TVA
title_full_unstemmed	Deposition of nickel films by TVA
title_sort	deposition of nickel films by tva
publisher	D.Ghitu Institute of Electronic Engineering and Nanotechnologies
publishDate	2008
url	https://doaj.org/article/feccd85af4334590abc332d0e0f2df32
work_keys_str_mv	AT surdubobc depositionofnickelfilmsbytva AT badulescum depositionofnickelfilmsbytva AT lunguc depositionofnickelfilmsbytva AT georgescucostinela depositionofnickelfilmsbytva
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Deposition of nickel films by TVA

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