In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors

The color filter required for manufacturing a CMOS image sensor was redeveloped to optimize its optical uniformity. An in-depth study of the three-dimensional (3D) coating process and how it gives rise to various radial-shaped striation patterns was conducted. These radial-shaped striation patterns...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Sungjun Kim, Jaesang Yoo, Hakyu Choi, Jaekwan Seo, Sunghun Lee, Sang Min Won, Jin-Hong Park, Keun Heo
Formato:	article
Lenguaje:	EN
Publicado:	IEEE 2021
Materias:	CMOS image sensor color filter process spin coating radial striation pattern fluidic dynamics process optimization Electrical engineering. Electronics. Nuclear engineering TK1-9971
Acceso en línea:	https://doaj.org/article/fedab6d35b1c44bd934194ab77bd46fc
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:fedab6d35b1c44bd934194ab77bd46fc
record_format	dspace
spelling	oai:doaj.org-article:fedab6d35b1c44bd934194ab77bd46fc2021-11-10T00:01:05ZIn-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors2169-353610.1109/ACCESS.2021.3121292https://doaj.org/article/fedab6d35b1c44bd934194ab77bd46fc2021-01-01T00:00:00Zhttps://ieeexplore.ieee.org/document/9586740/https://doaj.org/toc/2169-3536The color filter required for manufacturing a CMOS image sensor was redeveloped to optimize its optical uniformity. An in-depth study of the three-dimensional (3D) coating process and how it gives rise to various radial-shaped striation patterns was conducted. These radial-shaped striation patterns were systematically investigated with reference to two types of patterns: the orthogonal type found only at the orthogonal edges of the wafer and the diagonal type found mostly at the corner of each quadrant. The formation of the orthogonal pattern was based on the wide standing wave created by the incident force of the spreading color photoresist (PR) and the reflective force from the bump pads acting as coating barriers. The diagonal pattern was found to be generated by the turbulent wakes created behind the bump pads by the drag force, which interfered with the coating flow. An in-depth study using Ansys CFX software and an in-line inspection tool revealed that lowering the viscosity of the color PR material is a key factor for improving the phenomenon whereby the 3D striation patterns of the orthogonal and diagonal types are formed. Based on this finding, it was possible to drastically reduce the formation of the 3D striation patterns by decreasing the viscosity of the material comprising each color PR. This study provides not only an empirical and theoretical understanding of the 3D color PR coating mechanism, but also guidelines for future color filter processes.Sungjun KimJaesang YooHakyu ChoiJaekwan SeoSunghun LeeSang Min WonJin-Hong ParkKeun HeoIEEEarticleCMOS image sensorcolor filter processspin coatingradial striation patternfluidic dynamicsprocess optimizationElectrical engineering. Electronics. Nuclear engineeringTK1-9971ENIEEE Access, Vol 9, Pp 146525-146532 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	CMOS image sensor color filter process spin coating radial striation pattern fluidic dynamics process optimization Electrical engineering. Electronics. Nuclear engineering TK1-9971
spellingShingle	CMOS image sensor color filter process spin coating radial striation pattern fluidic dynamics process optimization Electrical engineering. Electronics. Nuclear engineering TK1-9971 Sungjun Kim Jaesang Yoo Hakyu Choi Jaekwan Seo Sunghun Lee Sang Min Won Jin-Hong Park Keun Heo In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors
description	The color filter required for manufacturing a CMOS image sensor was redeveloped to optimize its optical uniformity. An in-depth study of the three-dimensional (3D) coating process and how it gives rise to various radial-shaped striation patterns was conducted. These radial-shaped striation patterns were systematically investigated with reference to two types of patterns: the orthogonal type found only at the orthogonal edges of the wafer and the diagonal type found mostly at the corner of each quadrant. The formation of the orthogonal pattern was based on the wide standing wave created by the incident force of the spreading color photoresist (PR) and the reflective force from the bump pads acting as coating barriers. The diagonal pattern was found to be generated by the turbulent wakes created behind the bump pads by the drag force, which interfered with the coating flow. An in-depth study using Ansys CFX software and an in-line inspection tool revealed that lowering the viscosity of the color PR material is a key factor for improving the phenomenon whereby the 3D striation patterns of the orthogonal and diagonal types are formed. Based on this finding, it was possible to drastically reduce the formation of the 3D striation patterns by decreasing the viscosity of the material comprising each color PR. This study provides not only an empirical and theoretical understanding of the 3D color PR coating mechanism, but also guidelines for future color filter processes.
format	article
author	Sungjun Kim Jaesang Yoo Hakyu Choi Jaekwan Seo Sunghun Lee Sang Min Won Jin-Hong Park Keun Heo
author_facet	Sungjun Kim Jaesang Yoo Hakyu Choi Jaekwan Seo Sunghun Lee Sang Min Won Jin-Hong Park Keun Heo
author_sort	Sungjun Kim
title	In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors
title_short	In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors
title_full	In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors
title_fullStr	In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors
title_full_unstemmed	In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors
title_sort	in-depth study of 3d color-resist coating process for optically uniform image sensors
publisher	IEEE
publishDate	2021
url	https://doaj.org/article/fedab6d35b1c44bd934194ab77bd46fc
work_keys_str_mv	AT sungjunkim indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT jaesangyoo indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT hakyuchoi indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT jaekwanseo indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT sunghunlee indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT sangminwon indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT jinhongpark indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors AT keunheo indepthstudyof3dcolorresistcoatingprocessforopticallyuniformimagesensors
_version_	1718440805261115392

In-Depth Study of 3D Color-Resist Coating Process for Optically Uniform Image Sensors

Ejemplares similares