STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS

Electroactive polypyrrole (PPy) films obtained under potentiostatic electropolimerization from aqueous solutions of pyrrole doped with sulfate (SO4(2-)) anions were modified by incorporation of copper (Cu) and silver (Ag) microparticles using electrochemical cementation process. The electrochemicall...

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Autores principales:	Arrieta Almario,Álvaro A, Vieira,Roberto L
Lenguaje:	English
Publicado:	Sociedad Chilena de Química 2006
Materias:	Polypyrrole Electrochemical cementation Copper and Silver microparticles
Acceso en línea:	http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0717-97072006000300009
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id	oai:scielo:S0717-97072006000300009
record_format	dspace
spelling	oai:scielo:S0717-970720060003000092006-11-16STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESSArrieta Almario,Álvaro AVieira,Roberto L Polypyrrole Electrochemical cementation Copper and Silver microparticles Electroactive polypyrrole (PPy) films obtained under potentiostatic electropolimerization from aqueous solutions of pyrrole doped with sulfate (SO4(2-)) anions were modified by incorporation of copper (Cu) and silver (Ag) microparticles using electrochemical cementation process. The electrochemically deposited and dissolving processes metals (Cu and Ag) onto and from polypyrrole were investigated. The PPy-Cu and PPy-Ag electrodes were characterized by electrochemical techniques and scanning electron microscopy (SEM) analysis and the electrochemical response of these modified electrodes was compared to that of the unmodified polypyrrole electrode. The results indicate that two forms of metal, valence and elemental ones, can be formed on polypyrrole at a constant cathodic potential. However, only the valence metal can be left on polypyrrole at the anodic potential. The copper and silver particles interact with polypyrrole films involving a strong complex formation affecting its electrochemical behavior. Scanning electron microscopy measurements show that dendritic-like metal aggregates are formed on the film surface. The electrochemical experiments reveal that metal deposition on conducting polymer can be envisaged as an attractive method for the electrodes fabricationinfo:eu-repo/semantics/openAccessSociedad Chilena de QuímicaJournal of the Chilean Chemical Society v.51 n.3 20062006-09-01text/htmlhttp://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0717-97072006000300009en10.4067/S0717-97072006000300009
institution	Scielo Chile
collection	Scielo Chile
language	English
topic	Polypyrrole Electrochemical cementation Copper and Silver microparticles
spellingShingle	Polypyrrole Electrochemical cementation Copper and Silver microparticles Arrieta Almario,Álvaro A Vieira,Roberto L STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS
description	Electroactive polypyrrole (PPy) films obtained under potentiostatic electropolimerization from aqueous solutions of pyrrole doped with sulfate (SO4(2-)) anions were modified by incorporation of copper (Cu) and silver (Ag) microparticles using electrochemical cementation process. The electrochemically deposited and dissolving processes metals (Cu and Ag) onto and from polypyrrole were investigated. The PPy-Cu and PPy-Ag electrodes were characterized by electrochemical techniques and scanning electron microscopy (SEM) analysis and the electrochemical response of these modified electrodes was compared to that of the unmodified polypyrrole electrode. The results indicate that two forms of metal, valence and elemental ones, can be formed on polypyrrole at a constant cathodic potential. However, only the valence metal can be left on polypyrrole at the anodic potential. The copper and silver particles interact with polypyrrole films involving a strong complex formation affecting its electrochemical behavior. Scanning electron microscopy measurements show that dendritic-like metal aggregates are formed on the film surface. The electrochemical experiments reveal that metal deposition on conducting polymer can be envisaged as an attractive method for the electrodes fabrication
author	Arrieta Almario,Álvaro A Vieira,Roberto L
author_facet	Arrieta Almario,Álvaro A Vieira,Roberto L
author_sort	Arrieta Almario,Álvaro A
title	STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS
title_short	STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS
title_full	STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS
title_fullStr	STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS
title_full_unstemmed	STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS
title_sort	study of polypyrrole films modified with copper and silver microparticles by electrochemical cementation process
publisher	Sociedad Chilena de Química
publishDate	2006
url	http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0717-97072006000300009
work_keys_str_mv	AT arrietaalmarioalvaroa studyofpolypyrrolefilmsmodifiedwithcopperandsilvermicroparticlesbyelectrochemicalcementationprocess AT vieirarobertol studyofpolypyrrolefilmsmodifiedwithcopperandsilvermicroparticlesbyelectrochemicalcementationprocess
_version_	1718445364014481408

STUDY OF POLYPYRROLE FILMS MODIFIED WITH COPPER AND SILVER MICROPARTICLES BY ELECTROCHEMICAL CEMENTATION PROCESS

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