EFFECT OF THIOUREA CONCENTRATION ON THE ELECTROCHEMICAL BEHAVIOR OF GOLD AND COPPER ELECTRODES IN PRESENCE AND ABSENCE OF Cu(II) IONS
The effect of thiourea (TU) concentration on copper electrodeposition was studied employing cyclic voltammetry and electrochemical crystal quartz microbalance techniques. It was found that the polarization effects are related to the type of species generated in the electrode interface. Due to format...
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| Autores principales: | , , , |
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| Lenguaje: | English |
| Publicado: |
Sociedad Chilena de Química
2009
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| Materias: | |
| Acceso en línea: | http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0717-97072009000400026 |
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| Sumario: | The effect of thiourea (TU) concentration on copper electrodeposition was studied employing cyclic voltammetry and electrochemical crystal quartz microbalance techniques. It was found that the polarization effects are related to the type of species generated in the electrode interface. Due to formation of formamidine disulfde (FDS) at concentrations greater than 10-4 mol dm-3, the electrode surface is blocked, and copper electrodeposition shifts towards more negative potential values (polarizing effect). Lower concentrations favors the formation of Cu(I) -TU contributing to the de-polarization of copper electrodeposition reaction. |
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