INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS

This paper reviews techniques that can or have been used for determining the key properties of structural wood members, largely softwood lumber and structural panels. For solid wood materials, moisture content, density, and defects are underlying basic properties that must be assessed independently...

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Autor principal:	Beall,Frank C
Lenguaje:	English
Publicado:	Universidad del Bío-Bío 2007
Materias:	microwave density moisture content mechanical properties grading radiation adhesive bonding adhesive curing grain orientation internal defect scanning
Acceso en línea:	http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2007000200003
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spelling	oai:scielo:S0718-221X20070002000032007-08-23INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERSBeall,Frank C microwave density moisture content mechanical properties grading radiation adhesive bonding adhesive curing grain orientation internal defect scanning This paper reviews techniques that can or have been used for determining the key properties of structural wood members, largely softwood lumber and structural panels. For solid wood materials, moisture content, density, and defects are underlying basic properties that must be assessed independently to arrive at structural values. In reconstituted materials, an additional variable, adhesive quality dominates. In addition to reviewing these properties, an assessment is provided for the state of maturity of the relevant technologiesinfo:eu-repo/semantics/openAccessUniversidad del Bío-BíoMaderas. Ciencia y tecnología v.9 n.2 20072007-01-01text/htmlhttp://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2007000200003en10.4067/S0718-221X2007000200003
institution	Scielo Chile
collection	Scielo Chile
language	English
topic	microwave density moisture content mechanical properties grading radiation adhesive bonding adhesive curing grain orientation internal defect scanning
spellingShingle	microwave density moisture content mechanical properties grading radiation adhesive bonding adhesive curing grain orientation internal defect scanning Beall,Frank C INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS
description	This paper reviews techniques that can or have been used for determining the key properties of structural wood members, largely softwood lumber and structural panels. For solid wood materials, moisture content, density, and defects are underlying basic properties that must be assessed independently to arrive at structural values. In reconstituted materials, an additional variable, adhesive quality dominates. In addition to reviewing these properties, an assessment is provided for the state of maturity of the relevant technologies
author	Beall,Frank C
author_facet	Beall,Frank C
author_sort	Beall,Frank C
title	INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS
title_short	INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS
title_full	INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS
title_fullStr	INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS
title_full_unstemmed	INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS
title_sort	industrial applications and opportunities for nondestructive evaluation of structural wood members
publisher	Universidad del Bío-Bío
publishDate	2007
url	http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2007000200003
work_keys_str_mv	AT beallfrankc industrialapplicationsandopportunitiesfornondestructiveevaluationofstructuralwoodmembers
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INDUSTRIAL APPLICATIONS AND OPPORTUNITIES FOR NONDESTRUCTIVE EVALUATION OF STRUCTURAL WOOD MEMBERS

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