Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards
The effects of nanosize copper oxide and basic copper carbonate on the physical and mechanical properties of flakeboards were investigated according to ASTM Standard D-1037, and the curing process of phenol formaldehyde (PF) resin containing copper compounds was further investigated using dynamic di...
Guardado en:
Autores principales: | , , |
---|---|
Lenguaje: | English |
Publicado: |
Universidad del Bío-Bío
2011
|
Materias: | |
Acceso en línea: | http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2011000200008 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
id |
oai:scielo:S0718-221X2011000200008 |
---|---|
record_format |
dspace |
spelling |
oai:scielo:S0718-221X20110002000082011-08-24Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboardsGao,WeiCao,JinzhenKamdem,D. Pascal nanosize copper oxide basic copper carbonate flakeboard physical and mechanical properties differential scanning calorimetry The effects of nanosize copper oxide and basic copper carbonate on the physical and mechanical properties of flakeboards were investigated according to ASTM Standard D-1037, and the curing process of phenol formaldehyde (PF) resin containing copper compounds was further investigated using dynamic differential scanning calorimetry (DSC). The results showed that nanosize copper oxide had no or slightly beneficial effects on the mechanical properties and dimensional stability of the flakeboards. While basic copper carbonate increased thickness swelling and water absorption to some extent, the difference was not statistically significant. The DSC results indicated that the comparable activation energy and reaction enthalpy, obtained from nanosize copper oxide treated samples, contributed to the higher degree of conversion of PF resin and undiminished bonding strength of flakeboards, which is probably related to the acceleration of the addition reactions taking place among small molecules in PF resin and the enhancement of heat transfer of composite mat caused by nanosize copper oxide.info:eu-repo/semantics/openAccessUniversidad del Bío-BíoMaderas. Ciencia y tecnología v.13 n.2 20112011-01-01text/htmlhttp://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2011000200008en10.4067/S0718-221X2011000200008 |
institution |
Scielo Chile |
collection |
Scielo Chile |
language |
English |
topic |
nanosize copper oxide basic copper carbonate flakeboard physical and mechanical properties differential scanning calorimetry |
spellingShingle |
nanosize copper oxide basic copper carbonate flakeboard physical and mechanical properties differential scanning calorimetry Gao,Wei Cao,Jinzhen Kamdem,D. Pascal Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
description |
The effects of nanosize copper oxide and basic copper carbonate on the physical and mechanical properties of flakeboards were investigated according to ASTM Standard D-1037, and the curing process of phenol formaldehyde (PF) resin containing copper compounds was further investigated using dynamic differential scanning calorimetry (DSC). The results showed that nanosize copper oxide had no or slightly beneficial effects on the mechanical properties and dimensional stability of the flakeboards. While basic copper carbonate increased thickness swelling and water absorption to some extent, the difference was not statistically significant. The DSC results indicated that the comparable activation energy and reaction enthalpy, obtained from nanosize copper oxide treated samples, contributed to the higher degree of conversion of PF resin and undiminished bonding strength of flakeboards, which is probably related to the acceleration of the addition reactions taking place among small molecules in PF resin and the enhancement of heat transfer of composite mat caused by nanosize copper oxide. |
author |
Gao,Wei Cao,Jinzhen Kamdem,D. Pascal |
author_facet |
Gao,Wei Cao,Jinzhen Kamdem,D. Pascal |
author_sort |
Gao,Wei |
title |
Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
title_short |
Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
title_full |
Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
title_fullStr |
Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
title_full_unstemmed |
Effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
title_sort |
effect and mechanism of nanosize copper oxide on some physical and mechanical properties of flakeboards |
publisher |
Universidad del Bío-Bío |
publishDate |
2011 |
url |
http://www.scielo.cl/scielo.php?script=sci_arttext&pid=S0718-221X2011000200008 |
work_keys_str_mv |
AT gaowei effectandmechanismofnanosizecopperoxideonsomephysicalandmechanicalpropertiesofflakeboards AT caojinzhen effectandmechanismofnanosizecopperoxideonsomephysicalandmechanicalpropertiesofflakeboards AT kamdemdpascal effectandmechanismofnanosizecopperoxideonsomephysicalandmechanicalpropertiesofflakeboards |
_version_ |
1714202553591267328 |